Industry Directory | Manufacturer
Global supplier of advanced thermal processing equipment and processes to the electronics assembly market.
New Equipment | Board Handling - Storage
BTU: A Leading Manufacturer of High Temperature Controlled Atmosphere Furnaces Thick Film Firing Direct Bond Copper, Brazing, Sintering & Heat Treating Glass-to-Metal Sealing Diverse Atmospheres, Air, Nitrogen, Hydrogen & Forming
Lansmont's most powerful instrument ever, the SAVER� 9X30 captures drops, impacts, vehicle motion and vibration. This self-powered Field Data Recorder provides "best in class" 16 bit resolution on each of 9 dynamic channels capable of recording for
Electronics Forum | Wed Aug 14 16:30:55 EDT 2002 | sleech
Dan: Until I got deep into development of a vacuum assisted moisture removal process, I always thought that the bake process would be saddled by the lack of atmosphere in the chamber. I later learned that the conduction of temperature at reduced atm
Electronics Forum | Tue Jun 25 07:12:46 EDT 2002 | Daan Terstegge
Because BGA's are so hard to rework, you'll want the maximum process window for your reflow equipment, and this includes an inert atmosphere. But as long as solderability and temperature profile are well controlled you can have perfect results with a
Used SMT Equipment | Soldering - Reflow
Heating zones: 5 Cooling zones: 2 Total heating length: 66 in. Total cooling length: 26 in. Total process length: 127 in. Total on /off load length: 11 in. Overall system length: 138.5 in. Overall system width: 52 in. Overall system height: 5
Used SMT Equipment | Soldering - Reflow
2004 Vitronics XPM2 1030 The Vitronics Soltec XPM2 1030 is a reflow soldering and curing system used in electronics manufacturing. Here are some key specifications and features: Dimensions & Weights: Heating zones: 5 Cooling zones: 2 Total heating
Industry News | 2003-05-06 08:21:44.0
Will address key issues in the
Industry News | 2024-11-18 19:12:46.0
The SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19th at 11am EST.
Technical Library | 2007-11-08 17:35:46.0
A continuous furnace is ideal for processes requiring high production volumes, process consistency, and precision control. This overview discusses some of the newer temperature and atmosphere capabilities of continuous furnaces and addresses the various components that make up a continuous furnace.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Article Return to Front Page A Low Temperature Alte
Article Return to Front Page A Low Temperature Alte
| https://www.smtfactory.com/I-C-T-LV733-LV-Series-Vacuum-Reflow-Oven-Machine-pd44543571.html
I.C.T LV Series Vacuum reflow oven unparalleled heating performance and temperature control system meets the requirements of various welding processes. PCB Width
