Industry Directory: atomic layer deposit (3)

Picosun Oy

Industry Directory | Manufacturer

Atomic Layer Deposition technology for companies driven by innovation. Contact us now! Production-proven coating solutions for IC, MEMS, LED, sensor, & 3D component processing. Pioneers of ALD. Production-proven process.

Dow Electronic Materials

Industry Directory | Manufacturer

DEM develops and markets highly sophisticated materials used in the electronic materials segment of the global electronics value chain.

New SMT Equipment: atomic layer deposit (12)

Intro to Atomic Layer Deposition

New Equipment |  

Next Scheduled Public Courses: May 1-2, 2008 ~ Dallas, TX July 16-17, 2008 ~ San Francisco, CA At SEMICON West October 23-24, 2008 ~ San Jose, CA November 6-7, 2008 ~ Dallas, TX This course is designed to provide the student basics of Atomic La

PTI Seminars, Inc.

Copper Foils

Copper Foils

New Equipment |  

Oak-Mitsui is recognized as the technological leader in the manufacture of high-quality electrodeposited copper foils for the printed circuit board industry. With the strength of international scope, Oak-Mitsui produces both conventional cladding and

Oak Mitsui Inc.

Electronics Forum: atomic layer deposit (56)

Soldering an 18 layer 2oz. copper board

Electronics Forum | Fri Oct 18 16:24:05 EDT 2002 | russ

Big BIG BIGG wave with a lot of preheat capability both top and bottom. You may need to exceed the standard "100 C" top side preheat to 120C or so (be aware of any topside SMT going into reflow over the wave). A spray fluxer with very fine atomizati

Re: Tin-oxide deposits

Electronics Forum | Mon Oct 16 20:29:32 EDT 2000 | Dave F

Jason: How did you determine that the deposits are tin oxide? What does this stuff look like? Klein Wassink "Soldering in Electronics" (p. 221, quoting original work by others). States (in effect) tin (or solder) quickly forms a protective oxide

Industry News: atomic layer deposit (67)

IPC and SMTA Announce Session 3 Agenda for High Performance Cleaning and Coating Conference

Industry News | 2010-10-07 13:23:20.0

Industry-leading associations IPC and SMTA jointly announce the agenda for Session 3 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.

Association Connecting Electronics Industries (IPC)

PCB Design and Layout Guidelines

Industry News | 2018-10-18 11:15:12.0

PCB Design and Layout Guidelines

Flason Electronic Co.,limited

Technical Library: atomic layer deposit (10)

New development of atomic layer deposition: processes, methods and applications

Technical Library | 2020-09-08 16:43:32.0

Atomic layer deposition (ALD) is an ultra-thin film deposition technique that has found many applications owing to its distinct abilities. They include uniform deposition of conformal films with controllable thickness, even on complex three-dimensional surfaces, and can improve the efficiency of electronic devices. This technology has attracted significant interest both for fundamental understanding how the new functional materials can be synthesized by ALD and for numerous practical applications, particularly in advanced nanopatterning for microelectronics, energy storage systems, desalinations, catalysis and medical fields. This review introduces the progress made in ALD, both for computational and experimental methodologies, and provides an outlook of this emerging technology in comparison with other film deposition methods. It discusses experimental approaches and factors that affect the deposition and presents simulation methods, such as molecular dynamics and computational fluid dynamics, which help determine and predict effective ways to optimize ALD processes, hence enabling the reduction in cost, energy waste and adverse environmental impacts. Specific examples are chosen to illustrate the progress in ALD processes and applications that showed a considerable impact on other technologies.

University of Johannesburg

Effectiveness of Conformal Coat to Prevent Corrosion of Nickel-palladium-gold-finished Terminals

Technical Library | 2015-03-26 19:16:03.0

Nickel-palladium-gold-finished terminals are susceptible to creep corrosion. Excessive creep corrosion can result in device failure due to insulation resistance loss between adjacent terminals. The mixed flowing gas test has been demonstrated to produce creep corrosion on parts with nickel-palladium-gold finished terminals. Conformal coats are often used to protect printed wiring assemblies from failure due to moisture and corrosion. However, coating may not be sufficient to protect lead terminations from failure.In this study, acrylic, silicone, urethane, parylene, and atomic layer deposit (ALD) coatings were examined for their effectiveness at preventing corrosion of nickel-palladium-gold-finished terminals.

University of Maryland

Videos: atomic layer deposit (23)

High-efficiency PCBA Coating Line Machine

High-efficiency PCBA Coating Line Machine

Videos

High-efficiency UV Curing Oven Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCBA conformal coating machine, smt coating machine,

Dongguan Intercontinental Technology Co., Ltd.

PCBA UV Curing Oven

PCBA UV Curing Oven

Videos

High Performance​ UV Curing Oven Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCBA conformal coating machine, smt coating machine

Dongguan Intercontinental Technology Co., Ltd.

Express Newsletter: atomic layer deposit (216)

Partner Websites: atomic layer deposit (37)

Auction - Multi-Layer Technologies | The Branford Group

| http://www.thebranfordgroup.com/dnn3/Auction/MULA0623.aspx

Auction - Multi-Layer Technologies | The Branford Group Sign Up For Our Auction Email Alerts!         Home Auctions Upcoming Auctions Recent Auctions Asset Recovery Programs Industry Expertise Logistics

Beamworks Spark 400

1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_beamworks_spark400.html

For accurate and controlled paste deposit Dispensing Capability Line dispensing: down to 0.4 mm (0.016”) pitch Dot dispensing: down to 0.3 mm (0.012”) in diameter Capability to dispense solder paste or epoxy dots and lines

1st Place Machinery Inc.


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