Industry Directory | Manufacturer
Our main business is ODM for WiFi, 5G, and Thermal products. It is a SMT-based electronic product assembly company that enables PBA-SMT through SMT know-how For OEM & EMS
Industry Directory | Manufacturer
Wafer Dicing, Die Attach, Wirebond, Glob Top, Semiconductor Packaging, RF Assemblies, SMT, PCB Assembly, Chip-on-Board, Multi-Chip Modules, Die Stacking, Flipchip, Stud Bumping, Prototyping, Process Development, Proof of Concept.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi
Electronics Forum | Thu Nov 06 10:21:38 EST 2008 | mendcorp
Does anyone have a glass dome intallation process of Silicone dome cast that can survive the standard IPC reflow profile for lead-free processes? Please shear it with us.
Electronics Forum | Tue Oct 19 14:51:27 EDT 1999 | Kiet Dang
I'm trying to set up a SPC for a thermo compression beam lead attach process. We're using a west bonder thermo compression machine. I'd appreciate any input on temperature, pressure,tool, and critical process considerations. thanks, -kiet.
Used SMT Equipment | SMT Equipment
Product name: KD - 2077 high-speed dispensing machine Product number: KD - 2077 Products in detail Features: High speed dispensing/adapt to more stable range Equal to KE series of high-performance/operability Attaches great importance to the
Used SMT Equipment | SMT Equipment
Product name: KE - 2060 l JUKI chip mounter Product number: KE - 2060 l JUKI2060 chip mounter parameters: Mounting head: 3 Material stand: 80 Mount speed: 0.25 SEC/CHIP (3 head at the same time put in the attached SMT) Mounting speed:+ / - 0.
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Industry News | 2011-09-12 12:04:25.0
GPD Global will showcase its Positive Cavity Displacement (PCD) 'H' Series high-resolution pumps in Booth #439 at the upcoming IMAPS 44th International Symposium on Microelectronics
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Parts & Supplies | Pick and Place/Feeders
1. How to choose FEEDER for each specification material in SMT? A circle is 4MM. The spacing between the two materials is the middle. If the size of the FEEDER is 12MM, then the material is a 12 X 4MM Feeder. Mainly to see the width of the strip,
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Parts & Supplies | Pick and Place/Feeders
PANASONIC NPM-W2 Attachment(8 Nozzle Head):NPM N610104460AA Introducing the PANASONIC NPM-W2 Attachment(8 Nozzle Head):NPM N610104460AA - a 100% original new product that guarantees good quality and reliable performance for your SMT machines. Wi
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-12-15 03:06:24.0
The first process in the SMT industry is solder paste printing. After the solder paste printing is completed, electronic components are attached to PCB pads through a SMT machine, and then reflow soldered. A preliminary PCB board is roughly processed. SMT is a combination of multiple devices, and such a line is called an SMT production line. Our common PCBA is processed through this process. In SMT technology, each process is very important, and poor quality can be caused by different process defects. Today, we are discussing the causes and countermeasures of SMT printing collapse.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Wed Jun 22 00:00:00 EDT 2022 - Wed Jun 22 00:00:00 EDT 2022 | ,
Empire Chapter Webinar: LIVE Action Reflow Focused Process
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Austin, Texas USA | Production,Quality Control
Join an exciting downstream, solid pre-IPO company in the rolling hills of Austin. Work alongside an elite team of engineers with an excellent track record of success in the telecom industry! Their high-performance networking product technology is g
Career Center | South Plainfield, New Jersey USA | Management,Research and Development,Sales/Marketing
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | SanPedro, Philippines | Maintenance,Production
Set-up Equipment machine and ensure its proper operation for costumer satisfaction. Carry out all Proactive Maintenance (PM) tasks such as predictive maintenance, preventative maintenance, failure finding maintenance and calibration maintenan
Career Center | Chennai, India | Sales/Marketing
Experience in sales of inter-connect, passive, active, and electro-mechanical components Product Engineering Role as handling BOM, ECO, ECN in the New product introduction of Philips LCD TV and Kulicke and Soffa wire bonding m/c Process and Quali
Heller Industries Inc. | https://hellerindustries.com/thermal/
Thermal Process Solutions Leader - Heller Home » The Thermal Process Leader Leader in Thermal Process Solutions Focus on Leadership in Thermal Process Solutions for the SMT, Electronics Assembly, Power Device Assembly and Semiconductor Advanced Packaging Industries
Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-the-pcb-assembly-process/
What is the PCB Assembly Process? Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
