The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst
Electronics Forum | Thu Nov 11 17:49:54 EST 1999 | Jeff_Tamagi
Do I have to tin gold lead devices? Can I use indium? Can I use lead-free Can I use tin-free
Electronics Forum | Wed Jun 08 23:04:26 EDT 2022 | SMTA-64387544
Au thickness of 0.125 um should not cause solder joint embrittlement. Also, PCB fab should offer Au thickness range between 0.05-0.075 um for better process control and reliability. Higher Au thickness may suggest black pads leading to solder joints
Industry News | 2013-08-01 13:16:42.0
The SMTA announced that the Lead-Free Soldering Technology Symposium will be held on October 17, 2013 as a focused symposium at SMTA International in Fort Worth, TX.
Industry News | 2016-01-05 14:46:38.0
Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical.
The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
) Processes for Emerging Heterogeneous Integrated Packages Abstract— Reflowed indium metal has for decades been the standard for solder thermal interface materials
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