New Equipment | Solder Materials
Bars / Solid Wires Proposal Pro Contra Wave and selective soldering SN100C® Favourable price
EzPCB offers various kinds of surface finishing technology, including Sn/Pb, Ni/Au, immersion gold, chemical silver etc. Lead-free OSP finishing technology is our newly introduced service, and is welcomed by customers in the EU, US and in Austrilia.
Electronics Forum | Wed Apr 26 02:16:18 EDT 2006 | AR
We had x-ray and optical microscopy analyses done on transformers dip soldered with Sn/Pb, SN100C3 and SN100C4 alloys using temperatures 400�C ... 450 �C, with dip times of 2..4 seconds. We found that SN100C4 is at least as good as Sn/Pb 62/38 and SN
Electronics Forum | Tue Dec 30 21:14:22 EST 2003 | davef
You're thinking correctly. 80Au20Sn is incompatible with: * Sn/Pb * In/Sn * Sn/Pb/In * Sn/Pb/Bi Contact your solder supplier to obtain pictures of IMC.
Industry News | 2019-01-30 08:13:02.0
The SMTA is pleased to announce the Best Papers from SMTA International 2018. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to all winners.
Industry News | 2015-01-07 15:52:18.0
The SMTA is pleased to announce the Best Papers from SMTA International 2014. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.
Technical Library | 2024-06-19 13:59:50.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments:
Technical Library | 2013-08-29 19:52:43.0
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...
ON New and Original MBRA210LT3G in Stock SMA package ON New and Original MBRA210LT3G in Stock SMA package ON New and Original MBRA210LT3G in Stock SMA package TL431BQDBZR NXP 24AA025E48T-I/OT MICROCHIP 24LC16BT-I/OT MICROCHIP 24LC256-I/SN
ST New and Original STM32F407ZET6 in Stock LQFP-144 package ST New and Original STM32F407ZET6 in Stock LQFP-144 package ST New and Original STM32F407ZET6 in Stock LQFP-144 package TJA1040T/CM,118 NXP TJA1042TK/3/1J NXP TJA1043T,118 NXP TJA105
Hyland; Agilent Au over Ni on Cu is a widely used p
SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control If you don't see images, please visit online version at: http://www.smtnet.com/express/ News Forums SMT Equipment Company Directory Calendar Career
GPD Global | https://www.gpd-global.com/co_website/pdf/GPD-Global-CMRT-2021.xlsx
. Adjusted row spacing of misc cells to allow for different lengths of translated text and comments. 6. Removed the symbols for the metals on the standard smelter list (e.g., "Sn"). 7
