Industry Directory | Manufacturer
Micralyne offers a patented process for electroplating AuSn solder alloy, at compositions from 10 to 40 Sn (wt%), in patterned or unpatterned shapes onto metallized substrates at virtually any thickness.
New Equipment | Solder Materials
AuSn solder electroplating is a key technology developed by Micralyne to lower your production costs and give you a better MEMS product. This state-of-the-art, patented process for electroplating AuSn solder alloy is a giant step forward in electropl
EzPCB offers various kinds of surface finishing technology, including Sn/Pb, Ni/Au, immersion gold, chemical silver etc. Lead-free OSP finishing technology is our newly introduced service, and is welcomed by customers in the EU, US and in Austrilia.
Electronics Forum | Tue Dec 30 21:14:22 EST 2003 | davef
You're thinking correctly. 80Au20Sn is incompatible with: * Sn/Pb * In/Sn * Sn/Pb/In * Sn/Pb/Bi Contact your solder supplier to obtain pictures of IMC.
Electronics Forum | Wed Sep 29 14:46:59 EDT 2004 | Bryan Smith, Micralyne
I am curious to hear feedback on whether companies that could benefit from a AuSn solder plating process would prefer to bring it inhouse (ie. License) or outsource the plating. I look forward to your comments. Bryan Smith Micralyne www.goldtinsold
Industry News | 2020-03-19 13:12:42.0
The SMTA is pleased to announce the Best Papers from SMTA International 2019. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.
Industry News | 2007-11-27 12:28:45.0
FINEPLACER� FEMTO, introduced in beginning of 2007, is now optimized for one of the most sophisticated bonding application. Due to the high process flexibility the FEMTO can handle both laser bar processes AuSn and Indium.
Parts & Supplies | Pick and Place/Feeders
We sell JUKI machine Spare Parts Servo motor,Smt Feeder,Smt Sensor,Driver,Sever,Motor,Laser,Smt Belt.EJECTORect,If you have interest,you can conatact me JUKI 750(760) X DRIVER E9612721000 AU6550N2041 JUKI 710(720) DRIVER AU6310N2031 JUKI 750(760)
Parts & Supplies | SMT Equipment
SMT Motor JUKI 710 720 Drive board motor accessories TAMAGAWA DRIVER AU6310N2031 Juki motor models: JUKI 750/760 ZT Axis Motor P50B03003PXS22 100V 30W E93077250A0 E93067250A0 JUKI 750/760 X Axis Motor TS4513N1820E200 200V 600W E9611721000 JUKI 7
Technical Library | 2013-08-29 19:52:43.0
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...
Technical Library | 2016-11-17 14:37:41.0
With increasing LED development and production, thermal issues are becoming more and more important for LED devices, particularly true for high power LED and also for other high power devices. In order to dissipate the heat from the device efficiently, Au80Sn20 alloy is being used in the industry now. However there are a few drawbacks for Au80Sn20 process: (1) higher soldering temperature, usually higher than 320°C; (2) low process yield; (3) too expensive. In order to overcome the shortcomings of Au80Sn20 process, YINCAE Advanced Materials, LLC has invented a new solderable adhesive – TM 230. Solderable adhesives are epoxy based silver adhesives. During the die attach reflow process, the solder material on silver can solder silver together, and die with pad together. After soldering, epoxy can encapsulate the soldered interface, so that the thermal conductivity can be as high as 58 W/mk. In comparison to Au80Sn20 reflow process, the solderable adhesive has the following advantages: (1) low process temperature – reflow peak temperature of 230°C; (2) high process yield – mass reflow process instead of thermal compression bonding process; (3) low cost ownership. In this paper we are going to present the die attach process of solderable adhesive and the reliability test. After 1000 h lighting of LED, it has been found that there is almost no decay in the light intensity by using solderable adhesive – TM 230.
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Hyland; Agilent Au over Ni on Cu is a widely used p
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/materials-available/
(including Aluminum Bonding) Nelco 4000-13 160 Tg Allied 408 180 Tg Polyimide 230 Tg BT Epoxy 180 Tg Teflon Taconic Arlon Others including Flex Finishes include: Immersion Tin (Sn) Immersion Sliver (Ag) Immersion Gold (Au) ENTEK/OSP
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
. The Effect of Ni on The Integrity of The Interfacial Intermetallic in Sn-Based Solder Joints to Copper Substrates ." (Co-authors: Keith Sweatman and Tetsuro Nishimura
