Industry Directory | Manufacturer
Auspi Enterprises Co., Ltd., one of the professional suppliers of printed circuits in China. We found your company info on the web knowing that you're dealing with electronics, which we think you may have demand on pcbs.
Industry Directory | Manufacturer
professional manufacturer of pcb
New Equipment | Solder Materials
AuSn solder electroplating is a key technology developed by Micralyne to lower your production costs and give you a better MEMS product. This state-of-the-art, patented process for electroplating AuSn solder alloy is a giant step forward in electropl
Minimum line width/distance: 4mil; Minimum aperture: 0.25mm; Technique: Immerged Ni/Au+Entek; Layers and thickness: 7/L, blind hole board
Electronics Forum | Tue Oct 07 02:18:13 EDT 2003 | iman
Hi Experts, Pls help advise what is the expected range of PCB gold thickness over Ni (for ENIG/Electrolytic fabrication processes)? any referrence standards set by the IPC?
Electronics Forum | Tue Oct 07 08:38:05 EDT 2003 | davef
J-STD-001C requires removal of gold from (through-hole) component leads when the thickness of the gold layer is above 2.5 microns to prevent problems with embrittlement. The thickness of gold on an ENIG board typically is around 0.05 micron, resultin
Used SMT Equipment | Semiconductor & Solar
Standard Machine features and system description: Ultra-fine pitch and small ball bonding capabilities High frequency transducer operating at 138 kHz Applicable wire size of 0.6mil-2.0mil High speed XY table with linear motor technology High ac
Industry News | 2021-12-17 16:30:28.0
One of the most highly demanded applications for 80Au20Sn is semiconductor laser die-attach due to recent advancements that have made lasers an economical option for a multitude of new products. However, a key challenge with semiconductor lasers is thermal management, as these devices generate a significant amount of heat. Indium Corporation Product Specialist Jenny Gallery will present on how to manage heat with AuSn preforms at SPIE Photonics West, Jan. 22-27, San Francisco, Calif., U.S.
Industry News | 2013-02-04 14:14:48.0
Practical Components and its sister company Practical Tools will exhibit in booth A16 at the upcoming IPC APEX Expo
Parts & Supplies | Pick and Place/Feeders
N210095370AA COVER 0 KXFB0AU3A00 POST 0 KXF0E0NMA00 PLUG CP-30-HP-1 N210046856AA BRACKET 0 N510017083AA SPACER BSF-430E N510018125AA SCREW Cross recessed Countersunk head machine screw M2.5X8-4.8 A2J (Trivalen N210028733AA PLATE 0 KXFX064BA00
Parts & Supplies | Pick and Place/Feeders
N510017368AA BOLT Hexagon socket head cap screw M4X45-10.9 A2J (Trivalent) N510004786AA POST ETKRFT-25-250-1 N610018132AA COVER 0 MTNP000804AA JOINT KQ2W08-U01A N510020431AB CASE Mount Position Teach Jig Case N510018857AA BOLT Hexagon head bolt
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Shatil Haque, Lumileds Lighting (Malaysia) Sdn. Bhd. "Packaging of High-Power LEDs Using Au Stud Bump Interconnects" 2004: Chrys Shea, Cookson Electronics "Optimizing Stencil Design for Lead-free SMT Processing" 2003
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
reference [7], an optimum gold thickness was determined. At the low end, the gaps in the plating resulted in voiding. At the high end, excess IMC growth occurred during reflow and reliability testing. The bondline thickness (BLT) of indium solder preforms is
