Industry Directory | Manufacturer
Micralyne offers a patented process for electroplating AuSn solder alloy, at compositions from 10 to 40 Sn (wt%), in patterned or unpatterned shapes onto metallized substrates at virtually any thickness.
New Equipment | Solder Materials
AuSn solder electroplating is a key technology developed by Micralyne to lower your production costs and give you a better MEMS product. This state-of-the-art, patented process for electroplating AuSn solder alloy is a giant step forward in electropl
The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst
Electronics Forum | Wed Sep 29 14:46:59 EDT 2004 | Bryan Smith, Micralyne
I am curious to hear feedback on whether companies that could benefit from a AuSn solder plating process would prefer to bring it inhouse (ie. License) or outsource the plating. I look forward to your comments. Bryan Smith Micralyne www.goldtinsold
Electronics Forum | Fri Oct 01 18:12:02 EDT 2004 | Bryan Smith
Hi Greg, You can find details on our AuSn solder plating at http://www.goldtinsolder.com. Call me at 780-431-4412 if you have questions. Take care, Bryan
Industry News | 2007-11-27 12:28:45.0
FINEPLACER� FEMTO, introduced in beginning of 2007, is now optimized for one of the most sophisticated bonding application. Due to the high process flexibility the FEMTO can handle both laser bar processes AuSn and Indium.
Industry News | 2016-01-05 14:46:38.0
Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical.
The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html
Heller Industries Inc. | https://hellerindustries.com/intermetallics-growth/
. During reflow, with the addition of tin-lead solders, the intermetallic grows. With other board metal finishes, other metallics form, such as AuSn when soldering components to boards with gold-flash finish (and tin-lead solder
Heller 公司 | https://hellerindustries.com.cn/intermetallic-growth/
假焊 空洞 分层 组件开裂 金属间生长 无光泽焊点 × 属间化合物的生长 如果锡铅焊料粘附到含铅的铜上（通过电镀）和焊盘（通过热风或其他板式焊料涂覆方法），则形成锡铜金属间化合物. 通常是Cu6Sn5或Cu5Sn6，这种金属间化合物是导致焊料粘附到铜垫和引线上的原因. 在回流期间，通过添加锡铅焊料，金属间化合物会生长。对于其他板金属表面处理，会形成其他金属结构，例如将组件焊接到具有金光表面处理的板上时的AuSn (和锡铅焊料). 随着时间的流逝，金属间层不断增长. 它的生长速度取决于热漂移以及
