Industry Directory | Manufacturer's Representative
MiniATE Systems represents world class manufacturers of high quality IC Sockets & Connectors for Test & Burn-in, Development and Electronic Production.
Industry Directory | Manufacturer
PDR manufactures IR BGA rework stations, BGA rework equipment, and SMD rework stations. SMD soldering solutions for BGA Rework, CSP Rework, QFN Rework, LED Rework, 0201 Rework and more. Also offers thermal test equipment. est.1987
In-Line X-ray Inspection System Automatically in-line inspect Solder joint defects of PCBA and other defects on Hidden Components. Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently. Performing X-r
High-precision, ultra-high resolution high-end 2D, 3D CT X-ray examination equipment With the Focal spot 200nm-class tube developed by SEC, ultra-fine defects can be detected at least 1mm and high-precision tests can be performed with system precisi
Electronics Forum | Wed Mar 15 06:58:43 EDT 2017 | cyber_wolf
Rob, That's what I suspected but I would be interested to see studies that show that the voids are in fact detrimental to thermal and electrical performance. If the automotive industry is requesting
Electronics Forum | Tue Mar 14 14:15:03 EDT 2017 | dontfeedphils
I've always been happy with ~25% or less combined voiding on QFN ground pads (depending on the pad dimensions).
Industry News | 2015-05-07 19:28:29.0
MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.
Industry News | 2023-03-16 14:31:59.0
The SMTA is pleased to announce the Best Papers from SMTA International 2022. The winners were selected by members of the conference technical committee. For these exceptional achievements, a plaque is given to primary authors of all winning papers.
Technical Library | 2023-08-04 15:38:36.0
The MicroLeadFrame® (MLF®)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and thermal dissipation capabilities. The adaptation and acceptance of MLF/QFN packages in automotive high reliability applications has led to the development of materials and processes that have extended its capabilities to meet the performance and quality requirements. One of process developments that is enabling the success of the MLF/QFN within the automotive industry has been the innovation of side wettable flanks that provide the capability to inspect the package lead to printed circuit board (PCB) interfaces for reliable solder joints. Traditionally, through-board X-ray was the accepted method for detecting reliable solder joints for leadless packages. However, as PBC layer counts and routing complexities have increased, this method to detect well-formed solder fillets has proven ineffective and incapable of meeting the inspection requirements. To support increased reliability and more accurate inspection of the leadless package solder joints, processes to form side-wettable flanks have been developed. These processes enable the formation of solder fillets that are detectable using state-of-the-art automated optical inspection (AOI) equipment, providing increased throughput for the surface mount technology (SMT) processes and improved quality as well.
Technical Library | 2019-07-23 22:33:47.0
The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed.
![[SEC] 3D In-line AXI Solution X-eye 6300 X-ray Inspection Machine](https://img.youtube.com/vi/w-_v-XDRKro/sddefault.jpg)
3D In-line Automated X-ray Inspection system (machine) Model: X-eye 6300 X-ray Tube: 160kV / 500 µa Table Size: Max. 330 x 250mm Min. 50 x 50mm Detector: 12 inch FPXD Defection type (Application): BGA, PoP, chip, QFN, QFP, etc. - High-speed In-lin
TI New and Original LM53635MQRNLTQ1 in Stock IC VQFN22 , 22+ package LM53635MQRNLTQ1 3.5A, 36V Synchronous, 2.1MHz, Automotive Step-Down DC/DC Converter PIC16F1503T-I/MG QFN-16 Microchip 21+ 24LC128T-I/MNY TDFN-8 MICROCHIP 22+ NCP1403SNT1G
Career Center | South Plainfield, New Jersey USA | Engineering
Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Career Center | , Portugal | Engineering,Maintenance,Production,Quality Control,Technical Support
SMT Process engineer Quality Efficiency Continuous improvement 11 years of experience in high volume production in a Japanese corporation Expertise in: Solder paste printing (DEK, Panasonic) Adhesive dispensing (FUJI, Panasonic) Components Pick and p
SMTnet Express, September 6, 2018, Subscribers: 31,307, Members: Companies: 11,037, Users: 25,158 Improved Flux Reliability of Lead-Free Solder Alloy Solder Paste Formulated with Rosin and Anti-Crack Resin for Automotive and Other High Reliability
SMTnet Express, July 25, 2019, Subscribers: 32,181, Companies: 10,840, Users: 24,976 Voiding Performance with Solder Pastes Containing Modified SAC Alloys for Automotive Applications in Bottom Terminated Component Assemblies Credits: Indium
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/vacuum-demo-data.pdf
%) Normal Reflow Vacuum Reflow Heller Vacuum Data - Automotive QFN Automotive SMT – QFN Vacuum Parameters • Pump Rate: 300torr/sec • Dwell: 15 sec @ 10 torr Void Rate • No Vacuum: 20-40% • With Vacuum: <1% Low Void (<1%) Normal Reflow Vacuum Reflow 40
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=ALLEGRO&PN=A8603KESTR-R
! customer login required - 1 credit Status: Active Mounting Type: Surface Mount Logical Description: IC, Multiple-Output Regulator for Automotive LCD Displays Physical Description: Quad Flat No-Lead (QFN
