Industry News: avionics sealant (2)

Nordson ASYMTEK Demonstrates the Helios Dispenser for 1K and 2K Materials for Electronics Manufacturing at Bondexpo 2019

Industry News | 2019-09-13 07:56:55.0

Nordson ASYMTEK announces that it will demonstrate its Helios™ SD-960 Series Automated Fluid Dispensing System at Bondexpo, Stuttgart, Germany, in Hall 6, stand 6425.

ASYMTEK Products | Nordson Electronics Solutions

Nordson ASYMTEK Demonstrates the Helios Medium- to Large-Volume Dispenser at The Battery Show and Bondexpo

Industry News | 2018-09-10 18:47:33.0

Nordson ASYMTEK announces that it will demonstrate its Helios™ SD-960 Series Automated Fluid Dispensing System at The Battery Show, Novi, Michigan, USA and at Bondexpo, Stuttgart, Germany. The Helios dispenser deposits single- (1K) and two-component (2K) materials, such as abrasive thermal interface materials (TIM), silicones, epoxies, and greases. Applications include electronic and PCB assembly that requires potting, sealing, gasketing, and structural adhesives/staking for automotive, avionics, aerospace & military electronics, consumer electronics/telecom, and/or industrial products.

3M Electrical Solutions Division

Express Newsletter: avionics sealant (11)

SMTnet Express - July 17, 2014

SMTnet Express, July 17, 2014, Subscribers: 22938, Members: Companies: 13943, Users: 36480 Enhancing Thermal Performance in Embedded Computing for Ruggedized Military and Avionics Applications. Darren Campo, Jens Weyant, Bryan Muzyka; Advanced


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