Industry Directory: avoid popcorn bga (2)

Taiwan Dry Tech Corp.

Industry Directory | Consultant / Service Provider / Manufacturer / Other

Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.

SMT Dry Cabinets by Eureka Dry Tech

Industry Directory | Consultant / Service Provider / Manufacturer

Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD,PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.

New SMT Equipment: avoid popcorn bga (31)

ASYMTEK NexJet NJ-8 Jetting System with ReadiSet Jet Cartridge

ASYMTEK NexJet NJ-8 Jetting System with ReadiSet Jet Cartridge

New Equipment | Dispensing

The NexJet® 8 Jetting System with patented ReadiSet™ Jet Cartridge offers increased jet frequency combined with advanced consumable management - it's as easy as ReadiSet and Jet. ReadiSet Jet Cartridge reduces operator training time, cost-of-owner

ASYMTEK Products | Nordson Electronics Solutions

No.1 sales automatic bga rework station WDS-620 PS3 PS4 motherboard repair machine with free training

No.1 sales automatic bga rework station WDS-620 PS3 PS4 motherboard repair machine with free training

New Equipment | Rework & Repair Services

No.1 sales automatic bga rework station WDS-620 PS3 PS4 motherboard repair machine with free training  Business field Laptop and mother boards rework and repair. Game consoles applications rework and repair.  Small and medium size electronics a

Shenzhen Wisdomshow Technology Co,Ltd.

Electronics Forum: avoid popcorn bga (148)

Have any paper or data talking about "BGA Stencil design guideline for avoid bridge"?

Electronics Forum | Thu Sep 06 05:25:38 EDT 2018 | spoiltforchoice

I'm no expert but I think you will find the majority of discussions around BGA & good printing results focus on the PCB design and things like tented vias and pad definition. e.g https://macrofab.com/blog/bga-pad-creation-smd-nsmd/ After that, work

Have any paper or data talking about "BGA Stencil design guideline for avoid bridge"?

Electronics Forum | Thu Sep 06 03:43:00 EDT 2018 | cmchoue

Dear Experts, Have any paper or data talking about the design guideline for avoiding BGA solder bridge? I desire to know the rule(guideline)that compare difference stencil thickness and safe solder design distance (air gap) can avoid bridge.

Industry News: avoid popcorn bga (23)

Ball Grid Array Inspection

Industry News | 2018-10-18 09:58:15.0

Ball Grid Array Inspection

Flason Electronic Co.,limited

IPC Conference on Reliability Highlights New Findings in All Areas of Electronics Assembly

Industry News | 2011-08-24 17:13:21.0

The IPC Conference on Reliability: Assembly Process for a Reliable Product will be held November 1-2, 2011, in Irvine, Calif. The conference will address reliability issues that arise at the assembly level, dedicating half-day programs on new developments in each of three key areas: materials, processes, and test and inspection.

Association Connecting Electronics Industries (IPC)

Parts & Supplies: avoid popcorn bga (3)

JOT Optical BGA Rework Station FG-

JOT Optical BGA Rework Station FG-

Parts & Supplies | Repair/Rework

Three independent heaters control systems. FG-P6000 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking

Goodluck Electronic Equipment Co.,Ltd

Agilent Full-automatic BGA Ball Mounti

Agilent Full-automatic BGA Ball Mounti

Parts & Supplies | Repair/Rework

main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr

Goodluck Electronic Equipment Co.,Ltd

Technical Library: avoid popcorn bga (2)

What is the application of moisture proof dry cabinet?

Technical Library | 2019-04-11 05:59:57.0

Are your MSD safely stored? As humidity is found to be one of the key reasons for rejected products, many manufacturers are taking measures to control the humidity to increase their production efficiency and save the cost. In the industries of semi-conductor and electronics, the key section in which the rejected products are most probably to be made is that during the heating process of SMT, the IC(e.g.,PBGA,BGA,or TQFD) is likely to crack and thus cause non-effective welding because of the humidity. Climatest Symor® auto dry cabinet is the best solution to avoid the cracking and non#2;effective welding by dehumidifying the surface of your components. The dry unit can be used for 20 years without replacement,and controller is calibration free within 5 years.We attach dry cabinet application with different humidity range,welcome to download.

Symor Instrument Equipment Co.,Ltd

Solving the ENIG Black Pad Problem: An ITRI Report on Round 2

Technical Library | 2013-01-17 15:37:21.0

A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.

Celestica Corporation

Videos: avoid popcorn bga (6)

NexJet NJ-8 System with ReadiSet Jet Cartridge

NexJet NJ-8 System with ReadiSet Jet Cartridge

Videos

The NexJet® 8 System with ReadiSet™ Jet Cartridge offers increased jet frequency combined with advanced consumable management - it's as easy as ReadiSet and Jet. Read more at http://www.nordsonasymtek.com/nexjet

ASYMTEK Products | Nordson Electronics Solutions

DH-A2 automatic BGA rework station for computer and mobile phone repairing

DH-A2 automatic BGA rework station for computer and mobile phone repairing

Videos

Dinghua Technology-- the leading manufacturer of BGA rework station, Automatic screw locking machine, Automatic soldering station and non-standard equipment. For more details, please just contact John, WhatsApp/Wechat:+86 1576811 4827 , Skype: si

Shenzhen Dinghua Technology Development Co., Ltd.

Career Center - Resumes: avoid popcorn bga (1)

3+ years of experience in the PCB CAM engineering

Career Center | Erode, Tamilnadu India | Engineering

Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou

Express Newsletter: avoid popcorn bga (505)

SMTnet Express - June 12, 2014

SMTnet Express, June 12, 2014, Subscribers: 22834, Members: Companies: 13899, Users: 36331 Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow Arijit Roy; World Academy of Science, Engineering

Partner Websites: avoid popcorn bga (62)


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