Industry Directory | Consultant / Service Provider / Manufacturer
Full Service Electro Mechanical and Electronic Contract Assembly Services Provider
Industry Directory | Manufacturer
Electronic Assembly Solutions for high mix technology small to medium runs. Top quality with manufacturability engineering ingenuity.
The NexJet® 8 Jetting System with patented ReadiSet™ Jet Cartridge offers increased jet frequency combined with advanced consumable management - it's as easy as ReadiSet and Jet. ReadiSet Jet Cartridge reduces operator training time, cost-of-owner
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
Electronics Forum | Mon Jun 15 19:51:48 EDT 1998 | Earl Moon
I'm off (as you all know) to other pastures. You know - sheep tupping on the green (or some other Elizabethan BS). Anyway, I now have to go to work for a living, or retire (don't remember which), to make a living. Deeply invloved in micro BGA, CBGA,
Electronics Forum | Thu Dec 30 13:19:40 EST 1999 | jason
Are there any concerns or issues when connecting Tantalum caps Back to back.
Used SMT Equipment | Pick and Place/Feeders
Machine size: length 1500 * width 2000 * height 1500 (unit: mm) Machine structure: 3 groups of placement heads, different nozzles can be replaced automatically Machine specifications: standard version, front loading rack and tube load
Used SMT Equipment | Pick and Place/Feeders
Board size (without buffer function) minimum L50 x W30mm～maximum L1,480 x W510mm Substrate size (when using inlet and outlet buffer functions) Minimum L50 x W30mm～Maximum L540 x W510mm Substrate thickness 0.4~4.8mm Board conveying direction: left&
Industry News | 2013-10-09 10:29:04.0
GPD Global will exhibit in Stand 214 in Hall A4 at the Productronica International Trade Fair. On display will be the versatile Max Series platform for dispensing of SMT glue, solder paste, conductive adhesives, underfill, UV, LED and more, configured with the volumetric PCD4H dispense pump and shown for the first time will be the NCM5000 simplified jetting pump.
Industry News | 2003-06-04 09:19:23.0
With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.
Parts & Supplies | Pick and Place/Feeders
Hose for to fetch back unit z-axis
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Parts & Supplies | Pick and Place/Feeders
JUKI 710 head motherboard E8621715BA0 E86227150A0 Other juki parts: E86217210A0 BGA BOARD ASM E86217290A0 TEMPERATURE SENSOR PWB ASM. E86227150A0 HEAD SUB UNIT BASE ASM. E86227290A0 LIGHT 2 PWB ASM. E86237000A0 HEAD RELAY CIRCUIT BOARD ASM E86
Technical Library | 2020-02-26 23:24:02.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Technical Library | 2021-06-15 15:17:33.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-in-package (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the cir
A Sustainable Alternative - Humitector cards are halogen-free and cobalt dichloride free. Visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-humidity-indicator-card?utm_source=CLRYouTube&utm_medium=Vi
Events Calendar | Tue Jul 13 00:00:00 EDT 2021 - Tue Jul 13 00:00:00 EDT 2021 | ,
Webinar: How to Make Social Media Work for Your Business
Career Center | King, North Carolina | Management,Production,Quality Control
Production Supervisor Responsible for all aspects of department operations Directly supervised up to 80 team members Kaizen team leader 5S, Lean Manufacturing, working with Six Sigma tools Built team that continually produced 98% yields and Won
Career Center | THRISSUR, India | Maintenance,Production
HANDLING OF MAINTENANCE Camelot,Mascot, Selective Soldering,Wave Soldering,Aquastorm 200,H-500 HI-Z,Kolb,kerry&PBT,GETECH, ATI 105 & Final Touch 101,Heller,Btu&vapour phase,Shuttle,SRT,ESD ,Electrical maintenance . Knowledge in using SLIM KIC 2000&
Back to Top Questions or comments? Contact us © 1995-99 SMTnet
Back to Top Questions or comments? Contact us © 1995-99 SMTnet
| https://productronica.com/en/trade-fair/press/press-releases/detail/back-to-its-old-strength.html
productronica 2023: back to its old strength DE Deutsch English Discover productronica Trade fair topics PCB & EMS SMT Cables, Coils
GPD Global | https://www.gpd-global.com/peel-back-force-tester.php?utm_source=dsapril2017&utm_campaign=newsletter&utm_medium=text
Contacts Technical Support About Company Profile News Events Awards Employment » Peel Back Force Tester » Peel Back Force Tester Features Peel Back Force Tester Precisely measure the peel back force of carrier tape to verify your packaging systems are within specification
