Industry Directory | Manufacturer
Zoom Tech is a SMT related manufacturer and produces all brands of nozzles, correction jigs, back-up plates, other special tools, and etc.
Industry Directory | Manufacturer's Representative
PCB Mfg. & Assembly raw materials- CCL, DryFilm, PISM Ink, Copper Balls, Entry & Back-up board, Insulation material, Solder
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Singulate Straight Tab Routed Panels Store cut tabs inside tool for discarding at operator convenience Available with 3 blade types and choice of support dies Clean cut - requires no rework for deburring PCB edges Easy blade change in under 5 m
Electronics Forum | Wed May 17 17:13:47 EDT 2000 | Michael Parker
The MoonMan has spoken. Everybody get back up on the wall, its been long enough that this has been "off the wall". Wish I had more Rambus chips, just got my SMT process dialed in and ran out of stock. Damn.
Electronics Forum | Fri May 27 13:20:06 EDT 2016 | elton111
how are you. I have a problem with a table that the issue errori topaz. The issue is the message "Bring back component." a problem with the pick up parts vacum setting level is 100 and the current 111 with vacum head is 6. Can u tell me how to Calibr
Used SMT Equipment | Screen Printers
MPM UP2000HiE PRINTER Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps) Thickness rang
Used SMT Equipment | Screen Printers
Hello and thank you for your interest in our MPM UP2000 Hie Stencil Printer For Sale. See information below MPM UP2000 Hie Stencil Printer Model Number: UP2000/B Serial Number: 22303 Year 2003 Windows O/S MPM Software Version
Industry News | 2021-11-08 14:38:39.0
Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Parts & Supplies | SMT Equipment
Main Parts Part Name：TCM3000 BUSH BALL PART No：630 052 9623 Part Name：VANE(真空泵碳片)TCM-V822 (Size: 76.5*19.5*3.5mm) PART No： Part Name：PULLEY FLAT PART No：630 069 5373 Part Name：三洋TOOL HEAD (拆装吸咀治具) PART No：630 064 6627 Part Name：T
Parts & Supplies | SMT Equipment
Main Parts Part Name：TCM3000 BUSH BALL PART No：630 052 9623 Part Name：VANE TCM-V822 (Size: 76.5*19.5*3.5mm) PART No： Part Name：PULLEY FLAT PART No：630 069 5373 Part Name：TOOL HEAD PART No：630 064 6627 Part Name：TCM1000 BLOCK LOC
Technical Library | 2024-03-19 07:58:40.0
Introduction of Solder Paste Jet Dispensing Machine Step into the future of manufacturing with the Solder Paste Jet Dispensing Machine, meticulously crafted in Japan under the esteemed I.C.T brand. This cutting-edge equipment represents the pinnacle of precision engineering, delivering unrivaled performance and reliability. Let's dive into its exceptional features and applications. Transmission Structure System of Solder Paste Jet Dispensing Machine At the heart of this Solder Paste Jet Dispensing Machine lies a meticulously designed transmission structure system. Powered by X Y linear motor drive control, it achieves unprecedented precision in positioning. With a reciprocating position accuracy of 3σ±5um and a dynamic position accuracy of 3σ±3um across the X, Y, and Z axes, it ensures flawless execution of tasks with minimal deviation. The load-type gantry structure further enhances stability and accuracy, guaranteeing consistent performance even during high-speed operations. Advanced Function Configuration Flexibility and customization are the hallmarks of the Solder Paste Jet Dispensing Machine. It features a customizable platform tailored to meet the specific needs of diverse applications, ensuring optimal performance and efficiency. Additionally, the machine boasts advanced functionalities such as automatic correction of substrate warp height and real-time penetration monitoring. Equipped with dual cameras, it provides precise feedback for adjustments during the filling process, ensuring unmatched precision and quality. Function configuration.jpg Vision Non-stop Experience uninterrupted precision with the Vision Non-stop functionality of this machine. Capable of detecting 100 chips per second, it automatically identifies position and height deviations, enabling real-time compensation for coating actions. Dual compensation for path and glue amount further optimizes efficiency, minimizing waste and maximizing productivity. With its ability to print solder paste dots as small as 110um, it's perfectly suited for high-precision applications in ICs, BGAs, and beyond. Versatility in Configuration Options and Applications Adaptability is key in modern manufacturing, and the Solder Paste Jet Dispensing Machine delivers on all fronts. Offering a range of configuration options, including different valves tailored to various material viscosities and fluidity, it ensures optimal performance across diverse production scenarios. From semiconductor packages to LED back-end Mini-LED production, its versatility knows no bounds, making it an indispensable asset in a wide range of industries. Explore the Future of Manufacturing with I.C.T Join the ranks of industry leaders embracing the future of manufacturing with I.C.T's Solder Paste Jet Dispensing Machine. With its unrivaled precision, speed, and reliability, it's set to revolutionize your production processes and propel your business to new heights of success. Don't just keep up with the competition--surpass it with I.C.T's cutting-edge solutions. Unlock the Potential of Precision Manufacturing Delve deeper into the transformative power of precision manufacturing and discover how the Solder Paste Jet Dispensing Machine can unlock new possibilities for your business. From reducing production costs to improving product quality, the benefits are endless. Partner with I.C.T today and embark on a journey towards manufacturing excellence. Conclusion In conclusion, our Solder Paste Jet Dispensing Machine embodies the fusion of Japanese precision and I.C.T reliability, offering unparalleled efficiency in solder paste dispensing. With its advanced features and customizable options, it caters to the diverse needs of modern manufacturing processes. Experience the pinnacle of dispensing technology with our Solder Paste Jet Dispensing Machine. Overseas Technical Support by I.C.T At I.C.T, our commitment to customer satisfaction extends beyond the initial purchase. We provide comprehensive overseas technical support, including machine installation, debugging, and customer training. Our dedicated team ensures that your production line runs smoothly from the first product off the line to the seamless delivery of the machine. Partner with I.C.T today and elevate your manufacturing precision with our Solder Paste Jet Dispensing Machine. Contact us now to learn more about our solutions and take your production processes to new heights of efficiency and reliability.
Technical Library | 2007-04-04 11:43:41.0
The present work offers a discussion and a first case study to identify and illustrate voiding mechanisms for a particular TIM between a heat spreader and the back of a flip chip. Pronounced differences were observed between stencil printing and dispensing in terms of initial void formation, apparently related to the specific properties of the material. Measurements of the effects of heat ramp rate and peak temperature showed the subsequent evolution and final void size distribution to be determined by the initial part of the cure profile up to the material gelling temperature.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Events Calendar | Mon Jun 08 00:00:00 EDT 2020 - Mon Jun 08 00:00:00 EDT 2020 | ,
Practical Set-Up, Qualification of Cleaning Process in PCB Assembly
Events Calendar | Wed Apr 28 00:00:00 EDT 2021 - Wed Apr 28 00:00:00 EDT 2021 | ,
Continued Journey of Equality Expo
Career Center | , California USA | Engineering,Management,Production
Plant Operations Manager needed to start up new division of rapidly growing EMS provider in the bay area of California. Our client is known for exceptional quality and customer satisfaction and has the awards to back them up. They actively promote
Career Center | Milpitas, USA | Engineering,Maintenance
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking a high energy, creative, hands-on electro-mechanical engineer to join our team. Thi
Career Center | Mumbai, India | Maintenance,Management,Production,Technical Support
SMT Manufacturing, MYDATA/ Mycronic Machine Experience, SMT Production Execution, SMT Machine Maintainance Planning & Execution
Career Center | , | Maintenance
Specialized in Siemens equipment, and OmniExcel 7, MPM Ap25, Momentum.
Back to Top Questions or comments? Contact us © 1995-99 SMTnet
Back to Top Questions or comments? Contact us © 1995-99 SMTnet
KingFei SMT Tech | http://www.smtspare-parts.com/sale-10988530-x01l5201101-ai-spare-parts-n210192364aa-x02g52201-back-up-pin-for-rhs2b-ai-machine.html
X01L5201101 AI Spare Parts N210192364AA X02G52201 Back Up Pin For RHS2B AI Machine Leave a Message We will call you back soon
GPD Global | https://www.gpd-global.com/co_website/pdf/pbt/Wafer-Option-PBFT-PBT-3000M.pdf
ORIGINAL ISSUE 10 8 13 1 4 16 11 17 3 2 9 16 6 5 7 4 18 14 15 12 3 15 14 NOTED NOTED Wafer Peel Back Test Option Function Set Up Using WPBFT Mechanical Assembly Drawing Plumbing Diagram
