Industry Directory: back up memory (64)

CST, Inc.

Industry Directory | Other

The Memory Tester Company, Help Solve your Computer Memory Problems

KCA Electronics

Industry Directory | Manufacturer

Quick Turn Prototype & High Volume Production PCB. Microvia, Flex, Rigid Flex.

New SMT Equipment: back up memory (195)

Peel Back Force Tester (PBFT)

Peel Back Force Tester (PBFT)

New Equipment | Pick & Place

Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble

GPD Global

R100 Benchtop PCB Depaneling Router

R100 Benchtop PCB Depaneling Router

New Equipment | Depaneling

Safely Singulate Tab Routed Panels - With Dust Extraction Finish routing a tab routed PCB for singulation is a relatively slow process . However, in some cases, where the board contours and sensitive or overhanging components may require, this may b

FKN Systek

Electronics Forum: back up memory (1757)

compactflash memory process requirements

Electronics Forum | Fri Apr 19 07:50:24 EDT 2002 | pjc

I used to build flash memory products for M-Systems. Up to 30,000 per week. Nothing special in the process for these boards. 1mm and 0.4mm thick std. FR4 PCBs are used. Double-Sided reflow. The 0.4mm thin boards require process carriers. Panelized 24

Get back on the wall

Electronics Forum | Wed May 17 17:13:47 EDT 2000 | Michael Parker

The MoonMan has spoken. Everybody get back up on the wall, its been long enough that this has been "off the wall". Wish I had more Rambus chips, just got my SMT process dialed in and ran out of stock. Damn.

Used SMT Equipment: back up memory (353)

MPM UP2000 HiE PRINTER

MPM UP2000 HiE PRINTER

Used SMT Equipment | Screen Printers

MPM UP2000HiE PRINTER Substrate treatment                                                       Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps) Thickness rang

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

MPM UP2000 Hie

MPM UP2000 Hie

Used SMT Equipment | Screen Printers

Hello and thank you for your interest in our MPM UP2000 Hie Stencil Printer For Sale.  See information below MPM UP2000 Hie Stencil Printer Model Number: UP2000/B Serial Number: 22303 Year 2003 Windows O/S MPM Software Version

1st Place Machinery Inc.

Industry News: back up memory (1120)

Heller Industries Will Feature the MK7 Reflow Oven Featured at IPC APEX 2022 Booth #1920

Industry News | 2021-11-08 14:38:39.0

Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.

Heller Industries Inc.

Frost & Sullivan Award Highlights Heller Industries' Achievements in Global SMT Reflow Soldering Equipment Market

Industry News | 2013-05-21 22:12:09.0

Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.

Heller Industries Inc.

Parts & Supplies: back up memory (914)

Sanyo Main Parts

Sanyo Main Parts

Parts & Supplies | SMT Equipment

Main Parts Part Name:TCM3000 BUSH BALL PART No:630 052 9623 Part Name:VANE(真空泵碳片)TCM-V822 (Size: 76.5*19.5*3.5mm) PART No: Part Name:PULLEY FLAT PART No:630 069 5373 Part Name:三洋TOOL HEAD (拆装吸咀治具) PART No:630 064 6627 Part Name:T

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Sanyo Main Parts

Sanyo Main Parts

Parts & Supplies | SMT Equipment

Main Parts Part Name:TCM3000 BUSH BALL PART No:630 052 9623 Part Name:VANE TCM-V822 (Size: 76.5*19.5*3.5mm) PART No: Part Name:PULLEY FLAT PART No:630 069 5373 Part Name:TOOL HEAD  PART No:630 064 6627 Part Name:TCM1000 BLOCK LOC

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Technical Library: back up memory (4)

Made in Japan: Solder Paste Jet Dispensing Machine

Technical Library | 2024-03-19 07:58:40.0

Introduction of Solder Paste Jet Dispensing Machine Step into the future of manufacturing with the Solder Paste Jet Dispensing Machine, meticulously crafted in Japan under the esteemed I.C.T brand. This cutting-edge equipment represents the pinnacle of precision engineering, delivering unrivaled performance and reliability. Let's dive into its exceptional features and applications. Transmission Structure System of Solder Paste Jet Dispensing Machine At the heart of this Solder Paste Jet Dispensing Machine lies a meticulously designed transmission structure system. Powered by X Y linear motor drive control, it achieves unprecedented precision in positioning. With a reciprocating position accuracy of 3σ±5um and a dynamic position accuracy of 3σ±3um across the X, Y, and Z axes, it ensures flawless execution of tasks with minimal deviation. The load-type gantry structure further enhances stability and accuracy, guaranteeing consistent performance even during high-speed operations. Advanced Function Configuration Flexibility and customization are the hallmarks of the Solder Paste Jet Dispensing Machine. It features a customizable platform tailored to meet the specific needs of diverse applications, ensuring optimal performance and efficiency. Additionally, the machine boasts advanced functionalities such as automatic correction of substrate warp height and real-time penetration monitoring. Equipped with dual cameras, it provides precise feedback for adjustments during the filling process, ensuring unmatched precision and quality. Function configuration.jpg Vision Non-stop Experience uninterrupted precision with the Vision Non-stop functionality of this machine. Capable of detecting 100 chips per second, it automatically identifies position and height deviations, enabling real-time compensation for coating actions. Dual compensation for path and glue amount further optimizes efficiency, minimizing waste and maximizing productivity. With its ability to print solder paste dots as small as 110um, it's perfectly suited for high-precision applications in ICs, BGAs, and beyond. Versatility in Configuration Options and Applications Adaptability is key in modern manufacturing, and the Solder Paste Jet Dispensing Machine delivers on all fronts. Offering a range of configuration options, including different valves tailored to various material viscosities and fluidity, it ensures optimal performance across diverse production scenarios. From semiconductor packages to LED back-end Mini-LED production, its versatility knows no bounds, making it an indispensable asset in a wide range of industries. Explore the Future of Manufacturing with I.C.T Join the ranks of industry leaders embracing the future of manufacturing with I.C.T's Solder Paste Jet Dispensing Machine. With its unrivaled precision, speed, and reliability, it's set to revolutionize your production processes and propel your business to new heights of success. Don't just keep up with the competition--surpass it with I.C.T's cutting-edge solutions. Unlock the Potential of Precision Manufacturing Delve deeper into the transformative power of precision manufacturing and discover how the Solder Paste Jet Dispensing Machine can unlock new possibilities for your business. From reducing production costs to improving product quality, the benefits are endless. Partner with I.C.T today and embark on a journey towards manufacturing excellence. Conclusion In conclusion, our Solder Paste Jet Dispensing Machine embodies the fusion of Japanese precision and I.C.T reliability, offering unparalleled efficiency in solder paste dispensing. With its advanced features and customizable options, it caters to the diverse needs of modern manufacturing processes. Experience the pinnacle of dispensing technology with our Solder Paste Jet Dispensing Machine. Overseas Technical Support by I.C.T At I.C.T, our commitment to customer satisfaction extends beyond the initial purchase. We provide comprehensive overseas technical support, including machine installation, debugging, and customer training. Our dedicated team ensures that your production line runs smoothly from the first product off the line to the seamless delivery of the machine. Partner with I.C.T today and elevate your manufacturing precision with our Solder Paste Jet Dispensing Machine. Contact us now to learn more about our solutions and take your production processes to new heights of efficiency and reliability.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Effects of Assebly Process Variables on Voiding at a Thermal Interface.

Technical Library | 2007-04-04 11:43:41.0

The present work offers a discussion and a first case study to identify and illustrate voiding mechanisms for a particular TIM between a heat spreader and the back of a flip chip. Pronounced differences were observed between stencil printing and dispensing in terms of initial void formation, apparently related to the specific properties of the material. Measurements of the effects of heat ramp rate and peak temperature showed the subsequent evolution and final void size distribution to be determined by the initial part of the cure profile up to the material gelling temperature.

Universal Instruments Corporation

Videos: back up memory (208)

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Videos

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Heller Industries Inc.

Peel Back Tester

Peel Back Tester

Videos

Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble

GPD Global

Events Calendar: back up memory (6)

Wine Down Wednesday: Driving Innovation through Intrapreneurship

Events Calendar | Wed Dec 01 00:00:00 EST 2021 - Wed Dec 01 00:00:00 EST 2021 | ,

Wine Down Wednesday: Driving Innovation through Intrapreneurship

Surface Mount Technology Association (SMTA)

Practical Set-Up, Qualification of Cleaning Process in PCB Assembly

Events Calendar | Mon Jun 08 00:00:00 EDT 2020 - Mon Jun 08 00:00:00 EDT 2020 | ,

Practical Set-Up, Qualification of Cleaning Process in PCB Assembly

Surface Mount Technology Association (SMTA)

Career Center - Jobs: back up memory (7)

Plant Operations Manager - SMT Start up

Career Center | , California USA | Engineering,Management,Production

Plant Operations Manager needed to start up new division of rapidly growing EMS provider in the bay area of California. Our client is known for exceptional quality and customer satisfaction and has the awards to back them up. They actively promote

DCSI Consultants

Quality Engineer

Career Center | Santa Ana, California USA | Engineering,Quality Control

General Purpose: This position for a Quality Engineer must have electronics manufacturing and/or cable experience. Your electronics manufacturing background, PCBA, cabling experience, and expertise in auditing and maintaining AS9001 will be the keys

MX Memory Experts

Career Center - Resumes: back up memory (22)

Sr.SMT Engg / SMT Production Incharge

Career Center | Mumbai, India | Maintenance,Management,Production,Technical Support

SMT Manufacturing, MYDATA/ Mycronic Machine Experience, SMT Production Execution, SMT Machine Maintainance Planning & Execution

Welles Resume

Career Center | , | Sales/Marketing

Sales Engineer/Manager/Representative in electronics and publication/newspaper industries

Express Newsletter: back up memory (647)

Partner Websites: back up memory (12247)

Wafer Peel Back Test

GPD Global | https://www.gpd-global.com/co_website/pdf/pbt/Wafer-Option-PBFT-PBT-3000M.pdf

ORIGINAL ISSUE 10 8 13 1 4 16 11 17 3 2 9 16 6 5 7 4 18 14 15 12 3 15 14 NOTED NOTED Wafer Peel Back Test Option Function Set Up Using WPBFT Mechanical Assembly Drawing Plumbing Diagram

GPD Global


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