New SMT Equipment: bad bga (9)

Hanwha HM520 Pick and Place Machine

Hanwha HM520 Pick and Place Machine

New Equipment | Pick & Place

Hanwha HM520 Pick and Place Machine Hanwha HM520 Chip Mounter Patch speed: 80,000 CPH size:890x2370x1930mm​ weight:1605KG Product description: Hanwha HM520 modular pick and place machine, it's Hanwha's first modular chip mounter, 890MM length.Patch

Qersa Technology Co.,ltd

M50 - Pick and Place System

M50 - Pick and Place System

New Equipment | Pick & Place

Mechatronika's M50 Pick and Place System is a versatile automatic machine for placing SMD components from 0402 to 35 x 35 mm. Matured, high quality rigid construction, ease to program and excellent price to performance ratio make M50 perfectly suit

Mechatronika

Electronics Forum: bad bga (203)

bga reflow in water clean solder

Electronics Forum | Tue Apr 27 08:14:59 EDT 2004 | iqbal

Is anybody doing BGA soldering water clean solder. If yes how you are ensure cleaness. We have boards with Four BGA and 2000 chip and ICs.We are processing with no clean solder but we are getting bad wetting so now we are planning to switch to water

BGA Rework

Electronics Forum | Fri Feb 23 08:26:12 EST 2007 | realchunks

No, you can simply replace the bad BGA with a new one. If this is a one of kind BGA and you must use it, then you need to get it reballed.

Used SMT Equipment: bad bga (5)

Manncorp MC385V2-V

Manncorp MC385V2-V

Used SMT Equipment | Pick and Place/Feeders

Manncorp MC385V2-V Pick and Place Vintage: 2014 Details:   Windows 7 Professional Operating System Dual Placement Heads Placement Rate (IPC-9850): 5,500 CPH

Lewis & Clark

Manncorp MC385V1-V

Manncorp MC385V1-V

Used SMT Equipment | Pick and Place/Feeders

Windows XP Professional Operating System Single Placement Head Placement Rate (IPC-9850): 4,000 CPH Placement Rate Max: 5,000 CPH Min Component Size: 01005 Max Component Size: 100mm x 150mm Max Component Lead Pitch: 0.3mm BGA/CSP Placement Capability

Lewis & Clark

Industry News: bad bga (7)

Webtorial: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Industry News | 2013-01-02 16:01:34.0

A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components

Surface Mount Technology Association (SMTA)

How does PCB X-Ray Inspection Work?

Industry News | 2018-10-18 10:02:00.0

How does PCB X-Ray Inspection Work?

Flason Electronic Co.,limited

Parts & Supplies: bad bga (29)

Juki 40047579 FX3 HDD ASM JUKI Hard Disk With Software For JUKI FX3 Machine

Juki 40047579 FX3 HDD ASM JUKI Hard Disk With Software For JUKI FX3 Machine

Parts & Supplies | Assembly Accessories

Detailed Product Description Brand: JUKI Part Name: Hard Disk Part Number: 40047579 Machine: FX3 Machine Condition: New Origin: China 40047579 FX3 HDD ASM JUKI Hard Disk with software For JUKI FX3 Machine Detail Information: 1, Part Name: H

KingFei SMT Tech

Juki STOPPER INDICATOR SPRING

Parts & Supplies | Pick and Place/Feeders

> FUJINTAI TECHNOLOGY CO.,LTD JUKI E9572729CA0 LA (L) CABLE ASM. www.fujintai.com JUKI E95737290A0 MTC I/F(L) CABLE ASM. FUJINTAI TECHNOLOGY CO.,LTD JUKI E95738550A0 DISPESE SV ASM www.fujintai.com JUKI E95747210A0 BAD MARK SENSOR CABLE ASM. FUJI

FUJINTAI TECHNOLOGY CO.,LIMITED

Videos: bad bga (4)

SMT Barcode Inkjet Printer

SMT Barcode Inkjet Printer

Videos

SMT Barcode Inkjet Printer ETA-410 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. smt barcode Inkjet Printing Machine,pcb barcode printing

Dongguan Intercontinental Technology Co., Ltd.

PCB Laser Marking Machine

PCB Laser Marking Machine

Videos

ETA SMT PCB Laser Marking Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCB Laser Marking Machine,PCB Laser Marking System,PCB Aut

Dongguan Intercontinental Technology Co., Ltd.

Express Newsletter: bad bga (471)

Partner Websites: bad bga (38)

Heated Stage X-ray inspection

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/heated-stage

. Head-in-pillow One of the most commonly looked for defects is Head-In-Pillow or HIP. Often seen in Ball Grid Array (BGA) device connections post reflow, where the BGA ball and solder paste on the PCB pad do not form a cohesive joint

ASYMTEK Products | Nordson Electronics Solutions

Used Surface Mount I Pre-owned PCB Assembly - Lewis and Clark, Inc.

Lewis & Clark | https://www.lewis-clark.com/

: 5,000 CPH Min Component Size: 01005 Max Component Size: 100mm x 150mm Max Component Lead Pitch: 0.3mm BGA/CSP Placement Capability Dual-Vision Alignment System Integral Vacuum Max Placement Area: 13.8″ x 17.1

Lewis & Clark


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Private label coffee for your company - your logo & message on each bag!