Industry Directory | Manufacturer
An innovative thermal management company that is dedicated to address the thermal challenges that the electronics industry is facing.
Industry Directory | Consultant / Service Provider / Other
S.M.C.M. International GmbH, based in Switzerland, offers you diverse and comprehensive solutions in the area of international Debt Collection - Debt Recovery - Credit Management - Dispute Resolution.
New Equipment | Rework & Repair Equipment
Stainless Steel Brush (SH-60) 2 5/16" Made of over 300 long, fine, stainless steel bristles. Use to clean flux from solder joints, clean flux and adhesive from solder pad and for general cleaning purposes. Available in Standard and Miniature
New Equipment | Rework & Repair Equipment
Made of over 300 long, fine, stainless steel bristles. Use to clean flux from solder joints, clean flux and adhesive from solder pad and for general cleaning purposes. Available in Standard and Miniature sizes. Stainless Steel Brush (3 1/2"
Electronics Forum | Tue Jun 14 08:37:18 EDT 2005 | jdumont
Morning all, just took a look at a new board we just got in and the there are different pad areas under the same BGA. What happened is engineering uses wider trace sizes for some pads and those overlap when more than one go to the same pad. This caus
Used SMT Equipment | Board Cleaners
Speedline Technologies AquaJet Stencil Batch Cleaner and Resys ClosedLoop System For Sale The wash needs a control board. (Part Description: BL1700 CNTRL 16IN 16OUT) The Part Number to Purchase this board is 20-101-0214. Estimated cost is $349. We h
Used SMT Equipment | Screen Printers
Make: Mydata Model: My500 Vintage: 12/2011 Description: Jet Printer Details: • Windows XP • Individual Deposit Programming • Quick Mode Programming • Automatic Board Stretch and Board Warpage Compensation
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Industry News | 2022-11-11 07:33:41.0
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.
_11.jpg)
Parts & Supplies | Pick and Place/Feeders
Size comparison table for JUKI 500-508 nozzle model KE2010——2040 PART No. PART NAME SIZE(mm) REMARKS E3608-729-0A0 #500 ASS＇Y(2-HOLES) 0.5/1.0 E3600-729-0A0 #501 ASS＇Y Φ0.7/Φ0.2 E3601-729-0A0 #502 AS
Parts & Supplies | SMT Equipment
500/501/502/503/504/505/506/507/508 series nozzle for SMT JUKI machine KE2010——2040 PART No. PART NAME SIZE(mm) REMARKS E3608-729-0A0 #500 ASS'Y(2-HOLES) 0.5/1.0 E3600-729-0A0 #501 ASS'Y φ0.7/φ0.2 E3601-729-0A0 #502 ASS'Y φ0.7/φ0.4 E3602-729-0
Technical Library | 2007-01-31 15:17:04.0
The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber.
Technical Library | 2018-03-05 11:22:48.0
Growing demands for smaller electronic assemblies has resulted in reduced sizes of passive components, requiring the introduction of newer components, such as the 01005 devices. Component miniaturization presents significant challenges to the traditional surface mount assembly process. A successful assembly solution for these 01005 devices should be repeatable and reproducible, and should include guidelines for (i) the selection of solder paste and (ii) appropriate stencil and substrate pad design, and should ensure strict process control standards.
www.unisoft-cim.com/pcbtest.htm - In minutes the Unisoft ProntoTEST-FIXTURE software translates CAD & BOM files into real reference designators, netlists, X/Y component pin geometries, values, tolerances, part numbers, etc. This data is used by Test
1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
ORION Industries | http://orionindustries.com/pdfs/gappad.pdf
. * Graphs and data generated from Young's Modulus, calculated using 0.01 inch/min. step rate of strain with a sample size of 0.79 inch2. MODULUS * The modulus of Gap Pad VO is rate dependent due to its viscoelastic properties
| https://www.smtxtra.com/shop/machine-sales/nutek-open-lifo-xxl-size-ntm650sxxl/
Nutek Open LIFO, XXL-size, NTM650SXXL, Year: 2013 (Serial Nr.: 2012-0810E01) - SMT Xtra About Us Contact SMT XTRA +44 (0) 1302 247295 HOME SMT NOZZLES ASM (Siemens
.png)
