Industry Directory | Manufacturer
Design and Manufacture Desiccant Dry Cabinets for low humidity storage and baking of moisture sensitive components, PCBs, electronic materials, lab samples, digital media and medical devices.
Reflow cycle - runs the oven through the pre-defined temperature profile.> Bake cycle - used to drive the moisture from moisture-sensitive components.>
Oak-Mitsui is recognized as the technological leader in the manufacture of high-quality electrodeposited copper foils for the printed circuit board industry. With the strength of international scope, Oak-Mitsui produces both conventional cladding and
Electronics Forum | Fri Aug 06 10:07:50 EDT 2004 | blnorman
OSP has limited elevated temperature exposure capability. Couple that with the fact that solvents (IPA in particular) will remove the OSP. The more material you loose the higher the chances for pad oxidation. We ran an experiment with board washin
Electronics Forum | Tue Jul 16 00:53:39 EDT 2002 | kennyg
What is a typical time/temp baking cycle for an assembly prior to BGA rework? This bake is intended to prohibit PCB or nearby component damage as well as protect the component being removed for reball. A 24 hr bake at 125C would be great, but often
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2015-01-06 13:05:20.0
Indium Corporation's Graham Wilson, applications engineer, will present at the IMAPS France Workshop on Thermal Management in La Rochelle, France, on Feb. 5, 2015.
Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
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