New Equipment | Assembly Services
Dependend aluminum plate 2312 SMT turnover of aluminum plate baking dish Purpose: COB SMT electronics factory turnover and baking Aluminum plate side added 14 air holes, so the vinyl easier baked in the oven, more energy conservati
New Equipment | Assembly Services
Dependend aluminum plate of 2516 Purpose: COB SMT electronics factory turnover and baking Aluminum plate side added 14 air holes, so the vinyl easier baked in the oven, more energy conservation and environmental protection; Alum
Electronics Forum | Fri Aug 10 07:33:32 EDT 2007 | davef
Tran Since we all agree that J-001 has no baking requirement, why are you baking the boards? What is the purpose of this bake process?
Electronics Forum | Fri Aug 10 16:22:35 EDT 2007 | htran
Davef, The J Standard-001-DS(Ref. 4.9.3)does required board assembly bake out and the purpose of the bake out is to demoisturize the PWB and to prevent board delamination during reflow like you have mentioned earlier. Thanks for your inputs. I hav
Industry News | 2018-09-23 09:54:24.0
The industry’s leading manufacturer of critical cleaning, coating and lubrication products, MicroCare Corp. has extended its portfolio even further with the launch of new and progressive products which will be showcased at this year’s SMTA International in Chicago, Illinois, USA from 14 – 18th October, which includes a new series of flux remover pens.
Industry News | 2018-03-01 19:44:00.0
MicroCare Corp. stunned the PCB cleaning industry with a flurry of innovation at the massive IPC APEX EXPO in San Diego, CA this week with the launch of ten new cleaning products. Featured among these developments are popular flux-cleaning chemistries in a new, super-convenient, pocket-sized cleaning pen package. The new range features three formulations: the No-Clean Flux Remover, the RMA Flux Remover, and the Water-Soluble Flux Remover Pens. These three new cleaners have been designed to specifically remove fluxes quickly and safely and ensure PCBs will enjoy a long and productive life at the lowest possible cost.
Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. The purpose
| https://www.eptac.com/faqs/ask-helena-leo/ask/shelf-life-of-soldered-components
. The Scope, Purpose, Method Classification, and Coating Durability clauses may lead you (supplier or user) to make the correct decisions for the product
