Industry Directory | Consultant / Service Provider / Distributor / Manufacturer
The leader in component automation preparation since 1983. Surface mount, axial & radial tape and reel, programming, baking, distribution of all materials used in these processes. ISO9001-2008, WBE
Industry Directory | Consultant / Service Provider / Manufacturer
Specializing in SMD, AX, & RAD component tape & reel packaging, Lead forming, baking and hot solder dipping.
Do you have a unique component that isn’t available in tape and reel? Tired of hand placing those components because you don’t have a compatible feeder? Can’t find JEDEC trays for your components and you need one yesterday? The answer to all of
New Equipment | Cable & Wire Harness Equipment
Application: Aluminum tube NTC thermistor temperature sensor probe assembly for coffee maker, cookie maker, bread maker, roaster, toaster and other food processing, especially for coffee maker heating tray, bake tray. Resistance @200C R
Electronics Forum | Mon Jul 04 05:41:24 EDT 2016 | slouis2014
Can anybody advise what temperature can a BGA component on reel be bake and how long.
Electronics Forum | Tue Jul 22 20:47:21 EDT 2008 | davef
Q1. Can I do this myself on site? A1. Sure. Most companies demoisturate their components in-house. Q2. Can we use our Vitronics Soltec XPM820 Reflow Oven? A2. You can. Most of us would be using an oven like that in our product processing. If you look
Used SMT Equipment | SMT Equipment
Baking SMT on a cheap kitchen toaster oven is not difficult. You just need some patience and exploration good will. In this page you will read the manual procedure to bake SMD boards into a regular kitchen toaster oven appliance. Follows information
Used SMT Equipment | Conveyors
Speedlines Camalot1818 Underfill Agilent SJ 50 AOI Universal GSM PTF Panasonic FCB-2M Flip Chip Bonder Speedlines MPM accuflex Solder Paste Printer DEK 265 GSX Solder Paste Printing Autolink Engineering PTE LTD R4200 Offl
Industry News | 2003-04-23 08:21:34.0
Rohm has a new series of ultrasmall high-brightness side-emitting chip LEDs that use built in reflectors and lenses to deliver optimum luminous intensity from minimal PCB footprint and power drain.
Industry News | 2003-01-24 09:07:53.0
For Industrial, Telecom and Datacom Use
Parts & Supplies | Assembly Accessories
SMT MACHINE GENUINE Juki Spare Parts JUKI GAS SPRING B RH06 6Z51 40118515 Pats Specifications: Brand Name JUKI gas spring Part number 40118515 Model RH06 6Z51 Ensure Test in machine confirmation Guarantee 1 month usage for machine JUKI K
Parts & Supplies | Assembly Accessories
We also supply other smt samsung pick and place machine spare parts 1. Samsung equipment CP series CP40. CP45.CP45NEO. CP60 CP63 SM series of SM310.SM320, SM321, SM421, SM411, SM431, SM471, SM481, SM482, DECAN 2. Samsung Feeder CP Series: CP8MM-
Technical Library | 2018-09-21 10:12:53.0
Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.
Technical Library | 2024-09-02 18:48:58.0
The conversion to higher temperature "Lead Free" assembly reflow conditions has created an increased awareness that entrapped or absorbed moisture is a frequent root cause of thermally induced delamination at assembly reflow. There are two connected failure modes from entrapped moisture; incomplete resin cross-linking resulting in premature resin decomposition and also severe Z axis expansion from "explosive vaporization of the entrapped moisture at elevated temperatures at assembly reflow". Ultimately, both result in delamination failure. Other papers have shown the negative effects of entrapped moisture before lamination including delamination, red color, reduced thermal reliability and increased high speed signal loss. In this paper, various materials were tested for moisture sensitivity during lamination. Tests were performed at varying lamination conditions including a pre-vacuum step and "kiss" step. Pressure and cure temperature parameters were evaluated for minimizing or eliminating the effect of trapped moisture. Also included are the results of inner layer moisture removal baking conditions and their effect on peel strength and thermal reliability.
Full Automatic V-cut PCB Depaneler Introduction: This equipment can further improve the quality of depaneling. It can realize V-groove XY two-way automatic cutting, cutting aluminum & FR4 boards without burr, can connect the assembly line to realize
Article Return to Front Page A Low Temperature Alte
Article Return to Front Page A Low Temperature Alte
KingFei SMT Tech | https://www.smtspare-parts.com/sale-14034108-yamaha-yv-ys-calibration-kga-m880c-104-reel-ceramic-1005-component.html
Yamaha YV/YS Calibration KGA-M880C-104 Reel Ceramic 1005 Component Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/2019_ICEET_Program.pdf
. The Effect of Temperature and Atmosphere on the Sublimation of Some Dicarboxylic Acids Used in Fluxes Bev Christian, Ph.D., Independent Consultant Microstructural Evolution of Solder Joint under High Temperature Service Jie Geng, Ph.D
