PCB Depaneler Specification Model CW-F01-S Standard working area 350*350mm Power 220V, 4.2KW Manipulator Repeatability ±0.02mm Resolution ±0.01mm Board Positioning Dual workst
Electronics Forum | Mon Feb 04 12:30:25 EST 2002 | fmonette
Dave highlighted all the elements that must be considered to determine the optimal temperature and duration for a pre-rework PCBA bake process. As far as the component is concerned, it really depends if you care about not damaging the package for r
Electronics Forum | Sun Feb 03 08:44:25 EST 2002 | davef
There is no standard for baking an assembled board prior to BGA rework, nor should there be. The amount of time required to bake a board varies with: * Board material. * Board construction and layers. * Board size. * Components on the board. If som
Industry News | 2016-02-29 09:18:03.0
Inventec introduces new enhanced co-solvent, Topklean EL20P for challenging refluxing applications, To learn more about Topklean EL20P you can visit Inventec at IPC Apex exhibition, booth 1863.
Industry News | 2012-03-24 10:06:28.0
NEPCON China Becomes a Platform for the Debut of New Product Releases in Asia
Surface Mount Technology Association (SMTA) | https://www.smta.org/msd/msd.cfm
sensitive components during localized reflow. The default bake cycle for populated boards is 10 days at 90C. Upcoming Events June 23 Webinar: Communicating With Impact and Developing Your Authentic Presence June 23, 2020 June 25 Webinar: SMTA Chapter
: We have boards with PEM ® nuts being soldered during production. Has IPC established minimum soldering criteria for SMT PEM ® s? Read Answer Solder Flow Near Through-Hole Component Body Question
