Industry Directory | Manufacturer
Design and Manufacture Desiccant Dry Cabinets for low humidity storage and baking of moisture sensitive components, PCBs, electronic materials, lab samples, digital media and medical devices.
Industry Directory | Other / Consultant / Service Provider / Manufacturer
APS specializes in fast turnaround because we understand that our customers cannot sustain downtime on assembly lines. We provide Programming,Tape and Reel,DryPacking and Baking of IC's
auto PCB depaneling machine adopts the latest blade-type light weight design, which completes the micro-shear stress cutting stroke at one time, and is suitable for separating PCB circuit boards with V-grooves. If you want know how to choose the b
PCB depaneling equipment adopts the latest blade-type light weight design, which completes the micro-shear stress cutting stroke at one time, and is suitable for separating PCB circuit boards with V-grooves. If you want know how to choose the best
Used SMT Equipment | SMT Equipment
Baking SMT on a cheap kitchen toaster oven is not difficult. You just need some patience and exploration good will. In this page you will read the manual procedure to bake SMD boards into a regular kitchen toaster oven appliance. Follows information
Used SMT Equipment | Soldering - Reflow
Despatch TDF2-52-1E Bake Oven Brand: DespatchModel: TFD2-52-1ESerial number: 194309Max Operating Temperature: 343C (650F)F.A. DUCT 7.00" DIAEXH. DUCT: 2.50" x 13.5"F.A. Damper Blade Cut to: 1.38" DIA Holes 2XEXH. Damper Blade Cut to: 11.25LGMinimum p
Industry News | 2018-10-18 10:23:07.0
Typical RoHS Issues in PCB Assembly
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Technical Library | 2018-09-21 10:12:53.0
Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.
Technical Library | 2022-09-12 14:07:47.0
Unique component handling issues can arise when an assembly factory uses highly-moisture sensitive surface mount devices (SMDs). This work describes how the distribution of moisture within the molded plastic body of a SMD is an important variable for survivability. JEDEC/IPC [1] moisture level rated packages classified as Levels 4-5a are shown to require additional handling constraints beyond the typical out-of-bag exposure time tracking. Nitrogen or desiccated cabinet containment is shown as a safe and effective means for long-term storage provided the effects of prior out-of-bag exposure conditions are taken into account. Moisture diffusion analyses coupled with experimental verification studies show that time in storage is as important a variable as floor-life exposure for highly-moisture sensitive devices. Improvements in floor-life survivability can be obtained by a handling procedure that includes cyclic storage in low humidity containment. SMDs that have exceeded their floor-life limits are analyzed for proper baking schedules. Optimized baking schedules can be adopted depending on a knowledge of the exposure conditions and the moisture sensitivity level of the device.
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Career Center | Thane, INDIA India | Maintenance,Production,Technical Support
Experience: 12 years relevant work experience in repotted electronic manufacturing industries that includes Data Communications, Consumer Electronics and PC Manufacturing Industry. Work experience in Engineering process and Quality Control. Technica
Career Center | Thane, INDIA India | Maintenance,Production,Technical Support
Experience: 12 years relevant work experience in repotted electronic manufacturing industries that includes Data Communications, Consumer Electronics and PC Manufacturing Industry. Work experience in Engineering process and Quality Control. Technica
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/our-company/news-room/feature-content-roll-up-page/a-time-to-give-nordson-raises-more-than-1-million-for-our-communities
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Surface Mount Technology Association (SMTA) | https://www.smta.org/msd/msd.cfm
. The decision to bake components is strictly based on the status of the humidity indicator card when the bag is opened. 5. The clock of exposure time does not always stop when previously exposed components are returned to dry storage
