Electronics Forum | Fri Feb 06 03:56:47 EST 2004 | JaMi Smith
BGAs and QFPs packaged in Trays are oriented with Pin 1 or corner A1 oriented towards the Pin 1 identifier on one corner of the Tray, which is usually identified by a chamfered corner. The Trays themselves are usually governed by JEDEC Registered Ou
Electronics Forum | Fri Feb 01 15:09:43 EST 2008 | chef
Don't do it.!!!! Are you nucking futs? Why is pre-bake required? Are you producing in high humidity? Is the package of the device poroues enough to suck in moisture? Think, consider you will not get an even "bake", the outside of the reel will get
Industry News | 2018-10-18 10:23:07.0
Typical RoHS Issues in PCB Assembly
Industry News | 2016-02-11 22:57:15.0
Indium Corporation will feature Heat-Spring®, a compressible, recyclable, metal thermal interface material, at Strategies in Light on March 1-3 in Santa Clara, Calif.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
. While reels are the primary format for handling components, component counters will usually count components in trays, in sticks and individual snippets as well
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
understanding of solderability failure including ageing, test methods, both theoretical and practical, for circuit boards and components. It also shows how to test BGAs, LGA, CSP, PoP and flip chip packages on the shop floor in 10min The webinar gives practical
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