Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
New Equipment | Board Handling - Storage
Ideal solution to dry, bake, store & test Moisture Sensitive Devices Drying & Storage of Moisture Sensitive Devices is getting more and more important. With reliable design and leading specifications, X-Treme Series Auto Dry Cabinets are suitable f
SUSS MicroTec's newest product offering is a 300 mm lithography cluster which consists of an MA300 mask aligner module linked to an ACS300 spin-coating system. LithoPack300 (LP300) is specifically designed for wafer bumping and wafer level packaging
Electronics Forum | Tue Sep 03 18:14:35 EDT 2002 | fmonette
I have never heard about a requirement for temperature ramp-up for baking components at 125C. In general the concern for delamination with moisture sensitive components starts above 200C (peak body temp). Most important is you should bake your com
Electronics Forum | Tue Nov 19 02:59:24 EST 2002 | yngwie
Hi Experts out there, pls help me with the following matters. How important is the bare PCB baking ? What is the temperature for baking @ what RH ? What would be the impact for the ENTEK finished board should the baking is really necessary ? For t
Industry News | 2017-08-29 08:23:24.0
Seika Machinery announces that Michelle Ogihara, Senior Sales Manager at Seika, will co-chair the MSD Council Meeting with Mumtaz Bora, Peregrine Semiconductor, at SMTA International. The meeting is scheduled to take place Tuesday, September 19, 2017 at 2 p.m. in the Boardroom, Upper Level, South Ballroom of the Donald E. Stephens Convention Center, Rosemont, IL.
Industry News | 2019-06-10 22:30:02.0
Climatest Symor launched the new fast dehumidifying dry cabinets,the moisture can lower to
Technical Library | 2022-09-12 14:07:47.0
Unique component handling issues can arise when an assembly factory uses highly-moisture sensitive surface mount devices (SMDs). This work describes how the distribution of moisture within the molded plastic body of a SMD is an important variable for survivability. JEDEC/IPC [1] moisture level rated packages classified as Levels 4-5a are shown to require additional handling constraints beyond the typical out-of-bag exposure time tracking. Nitrogen or desiccated cabinet containment is shown as a safe and effective means for long-term storage provided the effects of prior out-of-bag exposure conditions are taken into account. Moisture diffusion analyses coupled with experimental verification studies show that time in storage is as important a variable as floor-life exposure for highly-moisture sensitive devices. Improvements in floor-life survivability can be obtained by a handling procedure that includes cyclic storage in low humidity containment. SMDs that have exceeded their floor-life limits are analyzed for proper baking schedules. Optimized baking schedules can be adopted depending on a knowledge of the exposure conditions and the moisture sensitivity level of the device.
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