New SMT Equipment: baking of modules (8)

Baking Dry Cabinet for storage of SMD, PCB, IC, comply with JEDEC033C(T40W-1200-6 Auto baking cabinet, 40C and 5%RH)

Baking Dry Cabinet for storage of SMD, PCB, IC, comply with JEDEC033C(T40W-1200-6 Auto baking cabinet, 40C and 5%RH)

New Equipment | Other

T40W-1200-6 is a plug and play, fully auto dry cabinet which will be stable at 40C and 15C. Fresh News We will participate Productronica 2015 show. The world’s leading trade fair for electronics development and production. http://www.productroni

Ace Dragon Corp.

EMS Science of Soldering

EMS Science of Soldering

New Equipment | Education/Training

EMS Science of Soldering© is the unique hands-on course that teaches all aspects of the soldering process using demonstrations, experiments and sophisticated audio/visual presentations. EMS Science of Soldering© is available in engineering, managemen

Electronics Manufacturing Sciences, Inc.

Electronics Forum: baking of modules (102)

Reputed Brands of Manufaturer of Baking Oven

Electronics Forum | Fri Aug 29 01:38:08 EDT 2008 | rameshr

Hai, We need baking Ovens for our MSL Components , kindly advice some reputed manufaturer related to the Oven manufacturer

Reputed Brands of Manufaturer of Baking Oven

Electronics Forum | Fri Aug 29 08:13:59 EDT 2008 | davef

Baking equipment, standard ovens * Grieve; 500 Hart Rd, Round Lake, IL 60073-2898; 847-546-8225 F847-546-9210 http://www.grievecorp.com * Blue M Electric, 304 Hart St., P.O. Box 320, Watertown, WI 53094; 920-261-7000 F920-262-3993 Stu Leech has po

Used SMT Equipment: baking of modules (4)

Fuji NXT III M6 base of 2 guid

Fuji NXT III M6 base of 2 guid

Used SMT Equipment | Pick and Place/Feeders

Main parameter Features of Fuji Mounter NXT-M6III: 1. Increased productivity. The high-speed XY manipulator and tape feeder and the newly developed camera "Fixed On-the-fly camera" can improve the mounting capability of all components,

Shenzhen Honreal Technology Co.,Ltd

Heller Convection SMT Reflow Oven 1826 MK5 with Temperature Range of 60-350°C and 183" 465cm Length

Heller Convection SMT Reflow Oven 1826 MK5 with Temperature Range of 60-350°C and 183" 465cm Length

Used SMT Equipment | Soldering - Reflow

The latest breakthroughs associated with the Mark 5 reflow system now provide you with an even lower cost-of-ownership. Heller's new heating and cooling advances deliver up to 40% reduction in nitrogen and electrical consumption. This makes the MK 5

Shenzhen Honreal Technology Co.,Ltd

Industry News: baking of modules (291)

Nam Tai Electronics, Inc. Announces Withdrawal of Registration Statement

Industry News | 2003-05-29 08:40:51.0

Withdrawal of Nam Tai's registration statement filed on Form F-3 for a proposed offering of 3,000,000 common shares of the company

SMTnet

2002 NEMI Roadmap Points to Areas of Opportunity for Industry

Industry News | 2003-04-07 10:16:38.0

Portable Products and Optoelectronic Applications Still Hold Promise for Growth

SMTnet

Parts & Supplies: baking of modules (10)

MPM P0864 relay of MPM

MPM P0864 relay of MPM

Parts & Supplies | Screen Printers

Product Name: P0864 relay; RELAY Part Number: P0864 Description: P0864 relay; RELAY Applicable models: AP UP presses P0864 relay; RELAY Solenoid valve Solenoid, Relay relay section MPM AP UP2000 P5981; P6245 MPM control solenoid valve

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

MPM P0866 relay of MPM

MPM P0866 relay of MPM

Parts & Supplies | Screen Printers

Product Name: P0866 relay; RELAY Part Number: P0866 Description: P0866 relay; RELAY Applicable models: AP UP Printing Presses P0866 relay; RELAY Solenoid valve Solenoid, Relay relay section MPM AP UP2000 P5981; P6245 MPM control solenoi

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Technical Library: baking of modules (15)

Moisture Measurements in PCBs and Impact of Design on Desorption Behaviour

Technical Library | 2018-09-21 10:12:53.0

Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.

National Physical Laboratory

Handling of Highly-Moisture Sensitive Components - An Analysis of Low-Humidity Containment and Baking Schedules

Technical Library | 2022-09-12 14:07:47.0

Unique component handling issues can arise when an assembly factory uses highly-moisture sensitive surface mount devices (SMDs). This work describes how the distribution of moisture within the molded plastic body of a SMD is an important variable for survivability. JEDEC/IPC [1] moisture level rated packages classified as Levels 4-5a are shown to require additional handling constraints beyond the typical out-of-bag exposure time tracking. Nitrogen or desiccated cabinet containment is shown as a safe and effective means for long-term storage provided the effects of prior out-of-bag exposure conditions are taken into account. Moisture diffusion analyses coupled with experimental verification studies show that time in storage is as important a variable as floor-life exposure for highly-moisture sensitive devices. Improvements in floor-life survivability can be obtained by a handling procedure that includes cyclic storage in low humidity containment. SMDs that have exceeded their floor-life limits are analyzed for proper baking schedules. Optimized baking schedules can be adopted depending on a knowledge of the exposure conditions and the moisture sensitivity level of the device.

Alcatel-Lucent

Videos: baking of modules (7)

Example of how to import CAD data and BOM files, and export to a Selective Soldering machine program setup file.

Example of how to import CAD data and BOM files, and export to a Selective Soldering machine program setup file.

Videos

www.unisoft-cim.com/solder.htm - The ProntoSELECTIVE-SOLDERING module from Unisoft is used by electronics manufacturers to generate the necessary programs for automatic PCB Selective Soldering machines in minutes. ProntoSELECTIVE-SOLDERING helps prog

UNISOFT Corporation

Example of how to import CAD data and BOM files, and export to an assembly machine program set up file.

Example of how to import CAD data and BOM files, and export to an assembly machine program set up file.

Videos

www.unisoft-cim.com/pcbplace.htm - The ProntoPLACE module from Unisoft is used by electronics manufacturers to generate the necessary programs for automatic PCB assembly machines in minutes. ProntoPLACE programs most popular surface mount (SMT) place

UNISOFT Corporation

Training Courses: baking of modules (3)

IPC-7711/7721 Specialist (CIS) Certification Training Course - Repair and Modification of PCBs (Modules 1, 3, 9-10)

Training Courses | | | IPC-7711/7721 Specialist (CIS)

The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.

ACI Technologies, Inc.

IPC-A-600 Acceptability of Printed Boards Training and Certification Program

Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)

The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.

PIEK International Education Centre

Events Calendar: baking of modules (1)

GfKOOR Series | Seminar Application and Utilisation of Protective Coatings for Electronic Assemblies

Events Calendar | Tue Oct 15 00:00:00 EDT 2024 - Thu Oct 17 00:00:00 EDT 2024 | ,

GfKOOR Series | Seminar Application and Utilisation of Protective Coatings for Electronic Assemblies

Surface Mount Technology Association (SMTA)

Career Center - Resumes: baking of modules (1)

NPI Engineer

Career Center | Theni, Tamilnadu India | Engineering

NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu

Express Newsletter: baking of modules (99)

Partner Websites: baking of modules (2126)

585199 - ENDWALL (5" IMP MODULES) TOP

Heller Industries Inc. | https://hellerindustries.com/parts/585199/

585199 - ENDWALL (5" IMP MODULES) TOP Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New

Heller Industries Inc.

modules Archives - Lewis and Clark, Inc.

Lewis & Clark | https://www.lewis-clark.com/product-tag/modules/

modules Archives - Lewis and Clark, Inc. Skip to content My Cart:  $ 0.00 0 View Cart Checkout No products in the cart. Subtotal: $ 0.00 View Cart Checkout Lewis and Clark, Inc

Lewis & Clark


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Selective Soldering Nozzles

Training online, at your facility, or at one of our worldwide training centers"
SMT feeders

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
SMT feeders

Easily dispense fine pitch components with ±25µm positioning accuracy.
2024 Eptac IPC Certification Training Schedule

Software for SMT placement & AOI - Free Download.
design with ease with Win Source obselete parts and supplies

Private label coffee for your company - your logo & message on each bag!