Layer Count: 2L Board Thickness: 0.8mm Dimension: 140*85mm Material: Rogers RO5880 Surface Copper: 35μm Min Hole Diameter: 2.0mm Min line Width/Space: N/A Surface Finish: ENIG Do you need a PCB for special signal requirement into your products? High
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Layer Count: 8L Board Thickness: 1.0mm Panel Dimension:190*86mm/2up Material: S1141 Copper on board surface: 35μm Min Hole Diameter: 0.1mm Min line Width/Space: 8/8mil Surface Finish: ENIG+Selective OSP in BGA area This quick turn PCB is manufacture
Electronics Forum | Mon Nov 25 16:12:52 EST 2002 | russ
there is a good article by AIM solder regarding tin. In a nut shell, if you do not apply flux or heat to tin finish you will never degrade it! I agree with the others that you need to check the thickness of the pure tin layer. We have forbidden ti
Electronics Forum | Fri Dec 16 08:00:26 EST 2005 | jax
What you are most likely dealing with: Insufficient Pure Sn layer ( multiple causes ) Because elevated temperatures accelerate the diffusion process, the thickness of the Pure Sn layer will reduce during every thermal cycle... ( bakeing PCBs, S
Industry News | 2017-04-13 06:06:32.0
Solderability Benchmarking, Failures & Testing Methods 14th August All our webinars are based on 2.30pm UK time go to https://www.bobwillis.co.uk/events/ Benchmarking you PCB surface finish or the impact of baking boards or components can be simple in production and the laboratoy. Long term solderability of component terminations and printed circuit boards is fundamental in modern assembly processes. This is all practical experience not just theory for the presenters countless studies in industry
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Technical Library | 2018-07-11 22:46:13.0
For a demanding automotive electronics assembly, a highly thermal fatigue resistant solder alloy is required, which makes the lead-free Sn-Ag-Cu type solder alloy unusable. Sn-Ag-Bi-In solder alloy is considered as a high reliability solder alloy due to significant improvement in thermal fatigue resistance as compared to a standard Sn-Ag-Cu alloy. The alloy has not only good thermal fatigue properties but it also has superior ductility and tensile strength by appropriate addition of In; however, initial results indicated a sub-par performance in joint reliability when it is soldered on a printed circuit board (PCB) with Electroless Nickel Immersion Gold (ENIG) surface finish. Numerous experiments were performed to find out appropriate alloying element which would help improve the performance on ENIG PCBs. Sn-Ag-Bi-In solder alloys with and without Cu additions were prepared and then tests were carried out to see the performance in a thermal fatigue test and a drop resistance test.to investigate the impact of Cu addition towards the improvement of joint reliability on ENIG finish PCB. Also, the mechanism of such improvement is documented.
Career Center | , India | Engineering,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
I am working as lab chemist and also involved in troubleshooting and process control of various processes in pcb industry
3D ICs With TSVs - Design Challenges And Requirements Heat Management in Printed Circuit Boards This report discusses the significance of heat management in the design of printed circuit boards (PCB).After an introduction into the basics of PCBs
SMTnet Express, April 11, 2019, Subscribers: 31,842, Companies: 10,737, Users: 25,981 Soldering Immersion Tin Credits: Atotech The stimulating impact of the automotive industry has sharpened focus on immersion tin (i-Sn) more than ever before
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/materials-available/
(including Aluminum Bonding) Nelco 4000-13 160 Tg Allied 408 180 Tg Polyimide 230 Tg BT Epoxy 180 Tg Teflon Taconic Arlon Others including Flex Finishes include: Immersion Tin (Sn) Immersion Sliver (Ag) Immersion Gold (Au) ENTEK/OSP
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post9030.html
) Plating for Printed Ciruit Boards IPC-4553 - Specification for Immersion Silver Plating for Printed Ciruit Boards IPC-4554 - Specification for Immersion Silver Tin for Printed Ciruit Boards IPC-4562
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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