Industry Directory | Manufacturer / Other
BGA Reballing Services - PBGA, TBGA, CBGA, and CSP reballing services as low as 0.02 cents/individual solder ball attachment. We provide solder column attachment, & tinning, by means of Hot Solder Dipping, for Electrical Components.
Industry Directory | Manufacturer
Contract Manufacturing, PCBA's, Wire Wrapping, Electro-mechanical, Vertical Integration, Sheet metal
New Equipment | Rework & Repair Equipment
Custom made reballing fixtures designed for your specific component. Allows for high yield reballing of multiple parts at one time. Use for ball attach to BGA components and for solder bumping of LGA's and QFN's. Simply send us the data sheet and
Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi
Electronics Forum | Mon Oct 15 11:27:48 EDT 2001 | rob_thomas
Hello all, Does anyone have any experience using solder quick preforms for ball attach on Flex? Thanks, Rob
Electronics Forum | Wed Aug 19 16:28:03 EDT 2015 | mdeley
Looking for a Santa Clara area contract service with capability to attach 15mil dia. solder coated Cu balls, ideally on a 12" x 18" PI panel, small job to start. T&R services are a plus. My initial search is coming up with device/component level r
Used SMT Equipment | Screen Printers
Very nice DEK Galaxy Ball Mount For Sale The machine is in excellent working condition and was just taken out of an Electronics company which went out of business! See attached pictures and information below Equipment Description DEK Type: B
Used SMT Equipment | Screen Printers
Very nice DEK Galaxy Ball Mount For Sale The machine is in good condition and was just taken out of an Electronics company which went out of business! See attached pictures and information below Equipment Description DEK Type: Ball Mount Mo
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
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Parts & Supplies | SMT Equipment
We also supply following Panasonic Spare parts : N510042809AA MOTOR N510017322AA BOLT N510031805AA SPACER N210117332AA WASHER N510017750AA BOLT N554C03700A O-RING N210084655AD BRACKET N210078988AB PLATE N210078991AB PLATE N210078992AD BRA
Parts & Supplies | Pick and Place/Feeders
BALL SPLINE N510068462AA We also supply following Panasonic Spare parts : N610073252AA Main Body:NPM 1043889510AA ADJUST BOLT N610084824AA Label(Main Body):NPM N610073372AA Main Body (H):NPM N610073583AA CPU BOX & Wiring:NPM N
Technical Library | 2007-06-21 17:03:16.0
The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture (...) While there have been several studies comparing these two attachment methods, this study highlights the effect of rework technique on the electrical characteristics and reliability of reworked BGAs.
Technical Library | 2015-02-19 16:54:34.0
Pad cratering is an important failure mode besides crack of solder joint as it’ll pass the regular test but have impact on the long term reliability of the product. A new pin pull test method with solder ball attached and positioning the test board at an angle of 30º is employed to study the strength of pad cratering. This new method clearly reveals the failure mechanism. And a proper way to interpret the finite element analysis (FEA) result is discussed. Impact of pad dimension, width and angle of copper trace on the strength is included. Some findings not included in previous research could help to guide the design for better performance
Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.
PCB magazine unloader/Multi magazine unloader how to receive the PCB after soldering, more detail check :https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/91.html Multi Magazine PCB unloader is used at the end of the SMT line for unlo
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | Philadelphia, New Jersey USA | Sales/Marketing
LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e
Career Center | Melbourne, Florida USA | Engineering,Research and Development
Harris Corporation (NYSE-HRS) is an international communications equipment company focused on providing product, system, and service solutions that take its customers to the next level. The company provides wireless, broadcast, government, and networ
Career Center | SanPedro, Philippines | Maintenance,Production
Set-up Equipment machine and ensure its proper operation for costumer satisfaction. Carry out all Proactive Maintenance (PM) tasks such as predictive maintenance, preventative maintenance, failure finding maintenance and calibration maintenan
Heller Industries Inc. | https://hellerindustries.com/semiconductor-advance-packaging/
curing, lid attach and ball attach. We offer multiple cleanroom class options and a range of automation options for wafers, wafers on frame, glass panels, and other substrates
Heller 公司 | https://hellerindustries.com.cn/semiconductor-advance-packaging/
半导体先进封装 » 半导体先进封装 半导体先进封装 HELLER Industries为半导体先进封装应用提供多种解决方案，如植球（Bumping)、芯片粘接(Die Attach)、底部填充固化(Underfill)、盖子粘接((Lid Attach)和球粘接(Ball Attach)。我们为晶圆、框架晶圆、玻璃面板和其他基板提供多种洁净室等级选项和一系列自动化选项。将您的焊接或固化挑战带给我们，我们经验丰富的工程师随时准备为您提供定制的解决方案。 球粘接(Ball Attach) 典型的球粘
