Industry Directory | Consultant / Service Provider
Winslow Automation has been advancing lead finish and soldering technology for the military and aeropace, telecommunications, medical, and consumer electronics industry since its inception in 1986.
Industry Directory | Manufacturer
Our main business is ODM for WiFi, 5G, and Thermal products. It is a SMT-based electronic product assembly company that enables PBA-SMT through SMT know-how For OEM & EMS
Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
Electronics Forum | Mon Mar 26 06:10:54 EDT 2007 | RH
Dennis: Have you considered Asahi as a solder ball source? Asahi Technologies has helped produce over 90 million Lead Free PWB assemblies worldwide and has extensive experience in Lead Free solder processes at Sony, Hitachi, and Thompson. Solutions
Electronics Forum | Tue Apr 01 18:42:18 EST 2003 | rdr
Well, here is what I have found so far. I have removed the top of the BGA and found that the ball had detached from the package. Three balls were removed with the two adjacent balls pulling the pads off the board and stayed attached to the BGA while
Used SMT Equipment | Pick and Place/Feeders
Highlights of the SIPLACE CA: With the four SIPLACE SpeedStar heads for high-precision placements you can process up to 126,000 SMT components, 46,000 flip-chips, or 30,000 die-attach components per hour Component supplied from changeov
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
Parts & Supplies | Pick and Place/Feeders
N210136905AB PLATE 0 N610124004AA フレキシブルコンベアステーション(搬送部)IPC対応 Flexible Conveyor St (Trannsport Unit) For IPC:NPM-D N210081910AB PLATE 0 N610087916AA 荷重キャリブレーションジグ Load Calibration Jig N210155534AA BRACKET 0 N610073135AA 交換台車切替ユニットガイド部:NPM Feeder
Parts & Supplies | Pick and Place/Feeders
N210095370AA COVER 0 KXFB0AU3A00 POST 0 KXF0E0NMA00 PLUG CP-30-HP-1 N210046856AA BRACKET 0 N510017083AA SPACER BSF-430E N510018125AA SCREW Cross recessed Countersunk head machine screw M2.5X8-4.8 A2J (Trivalen N210028733AA PLATE 0 KXFX064BA00
Technical Library | 2022-10-31 17:09:04.0
The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.
Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.
EZReball demonstration video. Simple and Fast new reball method! The new BEST EZReball™ process is an answer to your reballing problems. This unique method simplifies the reballing process allowing for better yields and faster reballing times. http:
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | Philadelphia, New Jersey USA | Sales/Marketing
LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e
Career Center | South Plainfield, New Jersey USA | Engineering
Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh
Career Center | SanPedro, Philippines | Maintenance,Production
Set-up Equipment machine and ensure its proper operation for costumer satisfaction. Carry out all Proactive Maintenance (PM) tasks such as predictive maintenance, preventative maintenance, failure finding maintenance and calibration maintenan
Heller Industries Inc. | https://hellerindustries.com/curing-oven/
: Process time: Generally 120 min or User’s spec Operating temp: 60oC ~ 200oC Maximum temp: 220oC Operating pressure: 1 bar – 10 bar Capacity: 24 Magazines (typical) Cooling method: PCW (17oC – 23oC) Cooling water pressure
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=ALTERA&PN=EP2S180F1508I4
: IC, Stratix II, 1.2-V, 90-nm, All-Layer Copper SRAM Process Physical Description: Ball Grid Array (BGA), 1.00 mm pitch, square; 1508 pin, 40.00 mm L X 40.00 mm W X 3.50 mm H body Manufacturer
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