Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
ZK Electronic Technology Co., Limited professional in Surface-Mount Technology area and supports most major brands of electronic asembly equipments with a large selections of compatible SMT.
Industry Directory | Other / Manufacturer
BGA Reballing Services - PBGA, TBGA, CBGA, and CSP reballing services as low as 0.02 cents/individual solder ball attachment. We provide solder column attachment, & tinning, by means of Hot Solder Dipping, for Electrical Components.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25
Used SMT Equipment | Pick and Place/Feeders
Heavy-duty, welded steel base frame w/ adjustable foot pads High-precision ball screw X-Y drive mechanism w/ linear encoders Three pick and place heads, each with servo-driven Z- and ?-axis motors Standard on-the-fly vision alignment cameras for c
Used SMT Equipment | Pick and Place/Feeders
MC389CY-F3-V MC-389 High-Speed, High-Mix Pick & Place WITH CONVEYOR Heavy-duty, welded steel base frame w/ adjustable foot pads High-precision ball screw X-Y drive mechanism w/ linear encoders Three pick and place heads, each with servo-drive
Industry News | 2011-09-12 12:04:25.0
GPD Global will showcase its Positive Cavity Displacement (PCD) 'H' Series high-resolution pumps in Booth #439 at the upcoming IMAPS 44th International Symposium on Microelectronics
Industry News | 2012-01-23 14:16:11.0
GPD Global will showcase its Positive Cavity Displacement (PCD) 'H' Series high-resolution pumps in Booth #2535 at the upcoming IPC APEX Expo.
Technical Library | 2007-06-21 17:03:16.0
The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture (...) While there have been several studies comparing these two attachment methods, this study highlights the effect of rework technique on the electrical characteristics and reliability of reworked BGAs.
Technical Library | 2022-10-31 17:09:04.0
The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Wed May 12 18:30:00 UTC 2021 - Wed May 12 18:30:00 UTC 2021 | ,
Joint Chapter Meeting: Photonic Soldering
Events Calendar | Sun May 03 18:30:00 UTC 2020 - Sun May 03 18:30:00 UTC 2020 | ,
Ball Grid Array Rework - How to Do It Successfully
Career Center | Philadelphia, New Jersey USA | Sales/Marketing
LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e
Career Center | South Plainfield, New Jersey USA | Engineering
Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh
Career Center | Littleton, CO USA | Production
Possess 18 years relevant work experience in manual/Auto bonding on Micro-Electronic & RF to support new product development in R&D Lab in defense & commercial sectors. Have an advanced soldering skill in both Through-Hole/SMT, and J-STD-001 cert
Career Center | Sto. Tomas, Batangas, Philippines | Engineering
SKILLS & EXPERIENCES A.Materials engineering and management 1.Handles matters about materials -Ceramic and laminate substrates & Surface Mount Devices (SMDs) i.e. chip capacitors and resistors -Perishable materials i.e. solder paste (including Pb-fr
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
KingFei SMT Tech | https://www.smtspare-parts.com/sale-36275171-kv1-m2803-01x-screw-ball-yt-axis-yg200-ball-screw.html
KV1-M2803-01X Screw Ball YT AXIS YG200 Ball Screw Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
Heller Industries Inc. | https://hellerindustries.com/parts/3897/
3897 - DUCT TAPE Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New! Dual Lane, Dual Temperature Reflow Oven Pressure Curing Ovens
