Electronics Forum: ball collapse (104)

BGA collapse during reflow

Electronics Forum | Mon Jul 12 09:13:08 EDT 1999 | Mark Charlton

I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-layer

Re: BGA collapse during reflow

Electronics Forum | Mon Jul 12 12:28:10 EDT 1999 | Wolfgang Busko

| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

Industry News: ball collapse (3)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Henkel's Materials Innovations Honored at APEX

Industry News | 2008-04-10 21:33:27.0

Market-leading electronic materials company, Henkel Corporation, continues to prove its commitment to developing inventive and process-enhancing materials technologies and last week this effort was recognized as the company received three prestigious awards during the APEX event in Las Vegas.

Henkel Electronic Materials

Express Newsletter: ball collapse (152)

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