Industry Directory | Manufacturer's Representative
Manufacturers Representatives for SMT Equipment and Materials serving Southern California and Baja, MX
New Equipment | Assembly Services
http://www.flason-smt.com/product/China-second-hand-LED-Assembly-Line-SMT-Assembly-Line-PCBA-Line.html China second hand LED Assembly Line/ SMT Assembly Line/ PCBA Line Name: SMT assembly line Usage: PCB production Type: Semi auto Production t
New Equipment | Assembly Services
http://www.flason-smt.com/product/LED-Assembly-Line-SMT-Assembly-Line-PCBA-Line-printer-mounter-reflow-oven.html LED Assembly Line/ SMT Assembly Line/ PCBA Line (printer+mounter+reflow oven) Name: SMT assembly line Usage: PCB production Type: S
Industry News | 2003-07-08 09:48:46.0
taking place September 28-October 2, at the Minneapolis Convention Center in Minneapolis, Minn.
Industry News | 2003-08-27 10:58:00.0
Lead free solders and embedded passives headline professional development schedule at the 2003 IPC Annual Meeting
Technical Library | 2015-09-23 22:08:32.0
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. (...) Flip chip bonding of bare die on MID can be employed to fully utilize MID’s advantage in device miniaturization. Compared to the traditional soldering process, thermo-compression bonding with gold stud bumps provides a clear advantage in its fine pitch capability. However, challenges also exist. Few studies have been made on thermocompression bonding on MID substrate, accordingly little information is available on process optimization, material compatibility and bonding reliability. Unlike solder reflow, there is no solder involved and no “self-alignment,” therefore the thermo-compression bonding process is significantly more dependent on the capability of the machine for chip assembly alignment.
SN100C P810 D4????????? ???????????? ??????????????????????????????????? ?????????????? ???http://www.nihonsuperior.co.jp/
Events Calendar | Mon Apr 12 18:30:00 UTC 2021 - Mon Apr 12 18:30:00 UTC 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Events Calendar | Mon Apr 12 18:30:00 UTC 2021 - Mon Apr 12 18:30:00 UTC 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
Career Center | Melbourne, Florida USA | Engineering,Production
Mechanical Engineer Candidate will work in the Advanced Manufacturing Technology organization executing the development, qualification, and implementation of leading-edge manufacturing processes across a broad range of applications and support manufa
SMTnet Express, May 8, 2014, Subscribers: 22716, Members: Companies: 13872, Users: 36158 Challenges in Bare Die Mounting Larry Gilg, Die Products Consortium Bare die mounting on multi-device substrates has been in use in the microelectronics
Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
Heller Industries Inc. | https://hellerindustries.com/heller/formic-acid-reflow-process/
Effective Formic Acid Reflow Process - Heller Home » Heller Blog » Tips on Creating an Effective Formic Acid Reflow Process Tips on Creating an Effective Formic Acid Reflow Process Fluxless reflow with formic acid offers numerous benefits, including higher yields by
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Non-Wetting A defect condition where part, or all, of a surface did not wet during the soldering process. Non-wetting is recognized by the fact that the bare base metal is visible
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