EPI offers assembly services for very complex boards and specialized manufacturing capability to fulfill Bare Die Direct, Flip Chip and Multi-Chip-Module requirements. EPI also has all military certifications from the Defense Electronics Supply Comma
KS-800 New High-precision multi-functional LED SMT Pick and Place Machine, eight head in one take and stick, low energy consumption; independent research and development of integrated light weight,all 8 sets of Z-axis are controlled by independent mo
Chip assembly? Classic SMT placement? Our SIPLACE CA can do both. The SIPLACE CA is the world's first placement platform that combines bare-die placement directly from the wafer and classic SMT placement in a single machine and a single production
Electronics Forum | Thu Apr 16 08:07:05 EDT 1998 | Stan
Currently I am in the buisness of soldering bare die to the top surface of a copper heat sink. Is any one else have some exprience in this process that can help. We heat a copper slug through a contolled atmosphere, place a preform then a bare die.
Electronics Forum | Fri Apr 17 14:08:44 EDT 1998 | Earl Moon
| Currently I am in the buisness of soldering bare die to the top surface of a copper heat sink. Is any one else | have some exprience in this process that can help. We heat a copper slug through a contolled atmosphere, place a preform then a bare
Used SMT Equipment | Chipshooters / Chip Mounters
NXT-H and NXT-Hw support placing small LEDs and bare dies at high-speed as well as performing hybrid production including flip chips.Fuji Ultra Accurate Placement Platform.Hybrid placement of wafers and SMDs. Wafer and reel part placement in a single
Used SMT Equipment | Chipshooters / Chip Mounters
NXT-H and NXT-Hw support placing small LEDs and bare dies at high-speed as well as performing hybrid production including flip chips.Fuji Ultra Accurate Placement Platform.Hybrid placement of wafers and SMDs. Wafer and reel part placement in a single
Industry News | 2003-04-29 07:30:06.0
Announce their plans to co-sponsor a free online conference on the current state of bare die packaging
Industry News | 2019-04-23 12:05:35.0
Speed up your wire crimp process with the right tools. Quick and Convenient Wire Crimping with this portable bench top unit . A custom 2 position die made to specifications speeds up the production process for this double barrel connector housing. The housing with 2 barrel contacts is placed into the tooling nest, and one AWG 4 wire is placed into each contact. Stepping on the pneumatic foot pedal crimps both wires and contacts at the same time.
Parts & Supplies | Pick and Place/Feeders
Other JUKI parts: JUKI IC Tray/feeder trolley JUKI KE-750,KE-760,FS-750,FM-760 O RING 70 PN: 40042257 JUKI 750 E93367250A0 MOTOR ENCODER TRUNK CABLE ASM. 1 JUKI KE2050 (2060) Cable Bare 40000740 PLASTIC RAIL Chain ASSY(Y AXIS) JUKI AC servo
Parts & Supplies | SMT Equipment
ORIGINAL SMT SPARE PARTS JUKI MTC TR-3S CONTROL BOARD E86017170B0 JUKI Nozzle Specifications: Brand Name JUKI CONTROL BOARD Part Number E86017170B0 Model Number Ensure Tested buy juki Guarantee 1 month usage for machine JUKI TR-3S Sell &
Technical Library | 2014-05-08 16:34:16.0
Bare die mounting on multi-device substrates has been in use in the microelectronics industry since the 1960s. The aerospace industry’s hybrid modules and IBM’s Solid Logic Technology were early implementations that were developed in the 1960’s. The technologies progressed on a steady level until the mid 1990’s when, with the advent of BGA packaging and chip scale packages, the microelectronics industry started a wholesale move to area array packaging. This paper outlines the challenges for both traditional wire-bond die attached to a printed wiring board (pwb), to the more recent applications of bumped die attached to a high performance substrate.
Technical Library | 2013-12-05 17:09:03.0
The functionality of electronic devices continues to increase at an extraordinary rate. Simultaneously consumers are expecting even more and in ever smaller packages. One enabler for shrinking electronics has been the flexible circuit board that allows the circuit board to fit a wide variety of shapes. Flexible printed circuits (FPC) have the capability to be very thin and can have unpackaged components directly attached using surface mount technology (SMT) and flip chip on flex technologies. Bare die can also be thinned and attached very close to the circuit board. However one caveat of high density flexible circuit boards with thin die is that they can be very fragile. The use of back side films and underfill can protect the die making circuits more robust. For underfill to work well it requires good adhesion to the circuit board which can mean that flux residues under the die normally must be removed prior to underfilling.
Full Automatic V-cut PCB Depaneler Introduction: This equipment can further improve the quality of depaneling. It can realize V-groove XY two-way automatic cutting, cutting aluminum & FR4 boards without burr, can connect the assembly line to realize
The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to
Career Center | Melbourne, Florida USA | Engineering,Production
Mechanical Engineer Candidate will work in the Advanced Manufacturing Technology organization executing the development, qualification, and implementation of leading-edge manufacturing processes across a broad range of applications and support manufa
Career Center | GARLAND, Texas USA | Production
exp in Fuji, Juki and universal smt pick and place machines . Component verification.
Career Center | GARLAND, Texas USA | Production
Fuji, Juki, Universal SMT pick and place machines experience.
SMTnet Express, May 8, 2014, Subscribers: 22716, Members: Companies: 13872, Users: 36158 Challenges in Bare Die Mounting Larry Gilg, Die Products Consortium Bare die mounting on multi-device substrates has been in use in the microelectronics
Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
ASCEN Technology | https://www.ascen.ltd/Blog/machines/223.html
PCB destacker bare board unloader-PCB magazine loader,PCB turn conveyor,pcb conformal coating machine,PCB router,PCB depaneling machine,pcb buffer conveyor from ASCEN technology Welcome to visit ASCEN | | | | | | | Cart
Lewis & Clark | http://www.lewis-clark.com/product-category/conveyor/page/2/
=0 Siemens WPW/3-950 Tray Loader Vintage: 2004 Details: 110v/208v – 50/60Hz CE Marked Simplimatic 3040 90° Turn Unit Make: Simplimatic Model: 3040 Details: 90° Turn Unit 110v – Single Phase Emergency Stop Button Condition
