I.C.T High Precision SMT PCB Dispensing Machine ❙ Introdution : Introduction: As functionality and performance increase in the electronics field, there is an increasing need for finer and more precise coatings. The HD series machine is a micro-
ViTrox’s V510 Optimus 3D AOI system is a next generation solution for the SMT line. The system offers closed-loop feedback and monitoring with a centralized management method that allows more effective defect image collections, centralized programmin
Electronics Forum | Wed Jan 16 15:22:29 EST 2002 | Terry Burnette
In his book titled "Manufacturing Techniques for Surface Mount Assemblies" author R.J. Klein Wassink describes the relationship between solder land dimensions, component lead coplanarity, board warpage, solder volumes, and solder paste flux wetting b
Electronics Forum | Thu Oct 14 23:01:48 EDT 1999 | Dennis O'Donnell
With loaded boards, warpage can be removed by placing the assembly in a wave solder conveyor pallet as you would if you were going to wave solder the assembly. Place board and fixture in a Blue M forced air oven at 90 C for 30 minutes. Let cool to r
Used SMT Equipment | Pick and Place/Feeders
Brand: FUJI Name: FUJI Scalble Placement Platform NXT Ii Module Width: 320mm Machine Dimensions: L：1295mm（M3 II×4, M6 II×2） Lntelligent Feeders: Support For 4, 8, 12, 16, 24, 32, 44, 56, 72, 88, And 104 Mm Wide Tape Trays: Applicable Tr
Industry News | 2019-09-18 16:03:56.0
IPC offers a day-long technical education seminar, Design for Excellence (DFX): DFM (Design for Manufacturing) DFR (Design for Reliability) DFA (Design for Assembly), in conjunction with PCB Carolina November 12, Raleigh, N.C., at the McKimmon Conference and Training Center.
Industry News | 2010-03-27 19:35:44.0
BANNOCKBURN, Ill., USA, - IPC — Association Connecting Electronics Industries® announced today the February findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
SMTnet Express, July 6, 2017, Subscribers: 30,558, Companies: 10,626, Users: 23,470 Effects of Package Warpage on Head-in-Pillow Defect Zhenyu Zhao, Chuan Chen, Yuming Wang, Lei Liu, Guisheng Zou, Jian Cai and Qian Wang - Tsinghua University
SMTnet Express, October 3, 2019, Subscribers: 32,260, Companies: 10,890, Users: 25,178 Effects of Temperature Uniformity on Package Warpage Credits: Akrometrix Knowing how package warpage changes over temperature is a critical variable in order
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smd-shear
) are electrical components that are soldered to printed circuit boards (PCB). Surface-mount technology has been the primary device attachment method for a wide variety of electronics since the 1980’s
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
• The true process window for Lead Free Solder is 10 - 20°C less than standard eutectic tin lead • Delta T on the PCB becomes critical
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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