Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def
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Electronics Forum | Mon May 14 19:16:49 EDT 2001 | jagman
Dave: Actually, I'm located in the South Bay (Santa Clara)! Good guess. Now, for more in-depth information: So far, the distribution has been limited to one board out of 10 assembled, so far from one lot. The components assembled are exclusively
Electronics Forum | Fri May 11 15:43:41 EDT 2001 | davef
More information would be helpful. For instance: * Talk about the distribution of the problem, including a single lot or from various lots and over components and component types on the board * Tell us about the board (ie, thickness, type, solder ma
Industry News | 2013-06-20 19:16:54.0
SMTA and Chip Scale Review magazine are pleased to announce the keynote presentation for the 10th Anniversary of the International Wafer-Level Packaging Conference, November 5-7, 2013 in San Jose, CA.
Industry News | 2010-04-10 02:07:54.0
IPC has released the E revision of IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. Recognized worldwide as the sole industry-consensus standard for soldering processes and materials, IPC J-STD-001E encompasses advanced technologies and provides new and updated criteria for all three classes of construction as well as expanded support for lead-free manufacturing.
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