Industry Directory | Equipment Dealer / Broker / Auctions
We are dealer for all SMT and auto-insert equipments, Panasonic, Yamaha, Fuji, Juki and other brand
The Texas Engineering Extension Service (TEEX) provides technical training seminars in process technologies for the semiconductor industry. These seminars are delivered on site with a select few offered via open enrollment.
New Equipment | ESD Control Supplies
The CT-8900 individually and simultaneously tests, prints, stores, and e-mails each wrist strap and heel grounder resistivity value in less than 3 seconds. Used at manufacturing companies internationally and domestically, it offers adjustable limits,
Electronics Forum | Fri May 15 21:12:13 EDT 2015 | jlawson
As far as I know is pretty basic and only matches IPN to a feeder , does not offer serialisation of actual parts. For trace this is not accurate ie trace a btach to a work order to couple of PCB not possible. This may have changed in latest JUKI off
Electronics Forum | Wed Sep 22 22:18:37 EDT 1999 | Dave F
| I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminations (no Sn/Pb)
Industry News | 2018-08-21 19:55:30.0
The SMTA is pleased to announce its election results for the Global Board of Directors for the term beginning during SMTA International (October 14 - 18, 2018). Jeff Kennedy, Celestica, Inc. has been re-elected as President. Timothy Jensen, Indium Corporation, Richard Coyle, Ph.D., Nokia Bell Labs and Robert Kinyanjui, Ph.D., John Deere Electronics Solutions, Inc. were re-elected to the Board of Directors. Bill Cardoso, Ph.D., Creative Electron, Inc. has been newly elected to the Board of Directors.
Industry News | 2022-08-14 14:10:49.0
The SMTA announced that the technical program of their annual conference, SMTA International, is finalized and registration is now open. The event will be held October 31 - November 3, 2022 at the Minneapolis Convention Center in Minneapolis, MN, USA.
Technical Library | 2019-06-19 11:06:46.0
Tin (Sn) metal displays the characteristic of growing “tin whiskers” from pure tin coatings (most actively on relatively thin, electrodeposited or immersion tin coatings), usually months or years from the initial deposition of the tin. Tin whiskers are electrically conductive, filamentary, single crystals of white (beta phase) tin. These filaments of single crystal tin are usually one to five microns in diameter, and a few microns up to several tens of millimeters long, that grow spontaneously from the tin coatings. Alloying additions of several percent (by weight) of lead (Pb) prevents these electrically conductive tin whiskers from growing. Pb alloyed into the Sn was discovered to prevent the occurrence of tin whiskers in electronic assemblies in the 1950s as the Bell Laboratories solution to the problem of tin whiskers. The alloying of the tin with lead has thus quietly averted incalculable losses from short circuits in electronic equipment for the last 60 years.
MPM UP 2000 HIE for sale,if you interested welcome to contact us soon. BOARD HANDLING Minimum/ 2" x 2" (50.0 mm x 50.0 mm) to Maximum size 20" x 16" (508 mm x 406 mm) (16" or greater board lengths require dedicated workholder) Thickness range
Career Center | Atlanta, Georgia USA | Engineering
Recognized leader in SMT pick and place capital equipment seeking Applications Engineer, having direct involvement in development and final implementation of lines for customer accounts. Gather needs requirements from clients. Involvement with proj
SMTnet Express, August 17, 2017, Subscribers: 30,720, Companies: 10,649, Users: 23,665 The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability Richard Coyle, Richard Popowich, Charmaine Johnson - Nokia Bell
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5296
. These alloys are based on the SAC system but have significant solute additions to promote solid solution strengthening at higher operating temperatures