New Equipment | Wave Soldering
SelHeat400 is a single rail inline preheating machine with an individual controlling system. It is equipped with IR heating for both upper and bottom sides, with touchscreen and PLC as a controlling system. The conveyor is equipped with a Smema conne
New Equipment | Selective Soldering
ECOSEL - 300 is a table top compact offline selective soldering machine. Solder pot and flux sprayer are fixed, the PCB is articulated with a X/Y stepper motor, Z with an air cylinder, inline N2 heating system, and the nozzle travel path can be progr
Electronics Forum | Wed Apr 23 07:19:12 EDT 2003 | bernard
Hi pete, We have being using the 8mm agilis feeder for nearly 12 months now, and contary to what you are finding the great advantage of this Mydata feeder system is that we loose very few components, you need no lead in etc. ( compared to other mach
Electronics Forum | Wed Apr 23 10:27:32 EDT 2003 | bernard
Hi Pete, What you are describing is something that will happen regardless of feeder type or machine type. When taking off a partial reel there is the potiential to lose components. It is minimised by careful handling. Yes I would agree that the Myda
Industry News | 2018-04-11 20:04:01.0
SMTA Europe announces Session 3 Technical Program on Advanced Test Methods at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2014-03-22 13:55:57.0
While induction into some Halls of Fame normally signals long-standing contributions that are honored at retirement, members of IPC’s newly formed Ambassador’s Council are sidelining their golden years to continue serving IPC and the electronics manufacturing industry.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2010-09-16 18:45:06.0
With PCB complexity and density increasing and also wider use of 3D devices, tougher requirements are now imposed on device inspection both during original manufacture and at their subsequent processing onto printed circuit boards. More complicated and de
, Dr. David Bernard, John Travis, Dr. Evstatin Kra
SMTnet Express, April 18, 2018, Subscribers: 31,006, Companies: 10,922, Users: 24,628 Semi-Additive Process for Low Loss Build-Up Material in High Frequency Signal Transmission Substrates Fei Peng, Naomi Ando, Roger Bernards, Bill Decesare; Mac
Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/2019_ICEET_Program.pdf
. Industrial IoT Solutions with Fiber Optic Sensors Hamid Alemohammad, Ph.D., AOMS Technologies Session 7: Components & Substrates Chair: Andre Delhaise, Ph.D., Celestica, Inc. Co-Chair: Jason Keeping, P.Eng., Celestica, Inc. Bare Board Insepection by X-ray - Ensuring a Sound Foundation for Assembly David Bernard
