Industry Directory | Manufacturer
AIM is a leading global manufacturer of solder assembly materials for the electronics industry.
Industry Directory | Manufacturer
Global soldering materials manufacturer founded in 1980 headquartered in IL. U.S.A. Products include: RoHS lead free solders + leaded, Metals Recycling Program, Solder Check Up Program, Technical Support. ISO 9001:2015 Certified
New Equipment | Solder Materials
Whether you are a hobbyist, sheet metal fabricator, or an electronics assembler, StellarTechincal.com provides quality solder for you, including lead-free solder wire. When you shop online at our business, you’ll be able to get a solder bar, babbit f
New Equipment | Solder Materials
Alloy: SAC 305, Mesh: -325+500, 250 gram Jar. Buy the jar, while supplies last.
Electronics Forum | Tue Nov 15 22:27:21 EST 2011 | Jacki
Hi Zaza Thanks. Again, very appreciate if you advise me where I can get the SN100C solder bar that is water soluable. Now I'm checking Nihon Superior(Singapore) whether they have or not. As our customer's preference, we have to use the watersoluab
Electronics Forum | Thu Dec 29 22:19:36 EST 2005 | Joseph
We have tested SN100C for LF wave soldering process since August'05 and currently start production for a month ago. Initially we use SAC305, but due to the shrinkage cavities (micro-crack) we changeover to SN100C. In summary, SN100C did perform well
Industry News | 2011-04-20 21:19:17.0
IPC – Association Connecting Electronics Industries® has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO™, held April 12–14, 2011, in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
Industry News | 2015-01-07 15:52:18.0
The SMTA is pleased to announce the Best Papers from SMTA International 2014. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.
Technical Library | 2023-09-07 14:38:31.0
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.
Technical Library | 2016-09-01 16:21:11.0
Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years, the price of silver has dramatically increased driving a desire for lower silver alloy alternatives. As a result, there is a significant increase in the number of alternative low/no silver lead-free solder alloys available in the industry recently. Our previous study showed that many alternative low silver solder paste materials had good printing and wetting performance as compared to SAC305 solder pastes. However, there is lack of information on the reliability of alternative alloy solder joints assembled using alternative low silver alloy solder pastes.In this paper, we will present the reliability study of lead-free solder joints reflowed using various lead-free alloy solder pastes after thermal cycling test (3000 cycles, 0°C to 100°C). Six different lead-free pastes were investigated. SAC305 solder joints were used as the control. Low and no silver solder pastes and a low temperature SnBiAg solder pastes were also included.
ALPHA® Preforms with solder paste adds solder volume.
SN100C P810 D4????????? ???????????? ??????????????????????????????????? ?????????????? ???http://www.nihonsuperior.co.jp/
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Lakewood, California USA | Engineering,Maintenance,Management,Production
Quality conscience, detail oriented, manufacturing engineer, with a hands on approach to overall process improvement and development. Motivated with excellent communication skills and a dedicated team player. Qualifications include: � Safety /Diver
SMTnet Express, Septemeber 1, 2016, Subscribers: 26,288, Companies: 14,937, Users: 41,025 Reliability Study of Low Silver Alloy Solder Pastes Jennifer Nguyen, David Geiger and Murad Kurwa; Flex (Flextronics International) Sn3.0Ag0.5Cu (SAC305
SMTnet Express, February 16, 2017, Subscribers: 30,171, Companies: 15,128, Users: 41,915 Component Level Reliability For High Temperature Power Computing With SAC305 And Alternative High Reliability Solders Thomas Sanders, Sivasubramanian
GPD Global | https://www.gpd-global.com/lead-free-solder-paste-dispensing.php
. PARTICLE TYPE MESH SIZE MICRON SIZE DOT SIZE (MM) 3 -325 +500 45-25 >0.50 4 -400 +635 38-20 >0.40 5 -500 25-15 >0.25 6 -635 15-5 >0.15 Solder Paste Dispensing with Auger Pump Solder Paste Dispensing is best accomplished with an auger pump
