Industry Directory | Manufacturer
Nordson Electronics Solutions makes reliable electronics an everyday reality. Our ASYMTEK, MARCH, and SELECT brands deliver precision fluid dispensing, conformal coating, plasma treatment and selective soldering equipment.
Industry Directory | Consultant / Service Provider / Manufacturer
BEST offers professional rework, repair and prototype builds of PCBs. Our expertise is on BGA rework and QFN rework. Our experienced instructors teach professional soldering classes as we are an IPC certified training center
New Equipment | Education/Training
This is a "real life" how to solder kit including both throughhole and SMT components. The board has ground planes that you would find in a real PCB assembly. Upon completion the sudents will have a working board. If you are trying to instruct new
New Equipment | Solder Materials
An easy-to-use cost-effective solution for producing professionally masked PCBs in an in-house prototyping environment. Compact, quick and easy to use Professional finish and perfect soldering Four simple steps to a professional result
Electronics Forum | Wed Apr 04 08:45:37 EDT 2007 | meritajs
Hi, colleagues! We only start using pb-free tehnology Our wave have foam fluxer What kind of flux would be best if we will use Sn100 solderbar What is your experience Best regards Peter
Electronics Forum | Wed Apr 04 10:48:25 EDT 2007 | pjc
Indium Corp. has some, 3549-HF and 3590-T, both are OK for foaming. Most of the better performing newer fluxes require spray application for best performance. Alpha, Kester and others have wave fluxes too. http://www.indium.com/products/circuitboar
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Industry News | 2003-03-04 08:08:23.0
In a move that broadens its interconnect design services, Micromark C and CD has introduced a new development kit for the Flexstrip jumpers flexible interconnect system.
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Parts & Supplies | Pick and Place/Feeders
Belt for sales instore : Conveyor Belt BHPP1441 1285MM Conveyor Belt LXT0763 1250MM Conveyor Belt MQC0700 2590MM Conveyor Belt MQC1033 3110MM Conveyor Belt BHPP6060 1685MM Conveyor Belt DGQC0320 1150MM Conveyor Belt BTQC0090 1500MM Conveyo
Technical Library | 2013-06-05 23:14:44.0
The combination of higher lead-free process temperatures, smaller print deposits, and temperature restraints on electrical components has created difficult challenges in optimizing the reflow process. Not only are the electronic components and the PWB at risk, but the ability to achieve a robust solder joint becomes difficult, especially if the PCB is thermally massive. In addition, the constant miniaturization of electronic components, hence smaller solder paste deposits, may require the use of smaller particle-sized powders (...) This paper is a summary of best practices in optimizing the reflow process to meet these challenges of higher reflow temperatures, smaller print deposits, decreased powder particle size, and their affect on the reflow process.
Technical Library | 2020-09-23 21:37:25.0
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. For soldering processes the only way that temperatures can be substantially reduced is by using solders with lower melting points. Because of constraints of toxicity, cost and performance, the number of alloys that can be used for electronics assembly is limited and the best prospects appear to be those based around the eutectic in the Bi-Sn system, which has a melting point of about 139°C. Experience so far indicates that such Bi-Sn alloys do not have the mechanical properties and microstructural stability necessary to deliver the reliability required for the mounting of BGA packages. Options for improving mechanical properties with alloying additions that do not also push the process temperature back over 200°C are limited. An alternative approach that maintains a low process temperature is to form a hybrid joint with a conventional solder ball reflowed with a Bi-Sn alloy paste. During reflow there is mixing of the ball and paste alloys but it has been found that to achieve the best reliability a proportion of the ball alloy has to be retained in the joint, particular in the part of the joint that is subjected to maximum shear stress in service, which is usually the area near the component side. The challenge is then to find a reproducible method for controlling the fraction of the joint thickness that remains as the original solder ball alloy. Empirical evidence indicates that for a particular combination of ball and paste alloys and reflow temperature the extent to which the ball alloy is consumed by mixing with the paste alloy is dependent on the volume of paste deposited on the pad. If this promising method of achieving lower process temperatures is to be implemented in mass production without compromising reliability it would be necessary to have a method of ensuring the optimum proportion of ball alloy left in the joint after reflow can be consistently maintained. In this paper the author explains how the volume of low melting point alloy paste that delivers the optimum proportion of retained ball alloy for a particular reflow temperature can be determined by reference to the phase diagrams of the ball and paste alloys. The example presented is based on the equilibrium phase diagram of the binary Bi-Sn system but the method could be applied to any combination of ball and paste alloys for which at least a partial phase diagram is available or could be easily determined.
ETA NEW Fully Auto SMT Stencil Screen Printer for LED ❙ Introduce of SMT Printer ETA ETA-4034 is a high precision automatic solder paste printer, correspond to industrial 4.0 and MES system.through a higher level of automation, ac
Good Service SMT Stencil Printer for PCB Assembly Line ❙ Introduce of SMT Printer ETA ETA-4034 is a high precision automatic solder paste printer, correspond to industrial 4.0 and MES system.through a higher level of automa
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)
The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
A Review of Test Methods and Classifications for Halogen-Free Soldering Materials A Review of Test Methods and Classifications for Halogen-Free Soldering Materials Over the last few years, there has been an increase in the evaluation and use
SCAVENGING Scavenging Scavenging, Site Dressing, Residual Solder Removal. What's in a name? "That which we call an onion, by any other name would smell as strong" (apologies to the immortal bard). And, regardless of the name you give it
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/category/panasonic-smt-pcb-1170/page/8?order=list_price+asc
High-Quality SMD PCB Boards For The Best Prices × Home about Us ABOUT US FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us PRODUCTS CATEGORY Show categories Categories All Products AI SPARE
Heller Industries Inc. | https://hellerindustries.com/award/best-practices/
2020 Best practices Award - Heller Home » 2020 Best practices Award 2020 Best practices Award As an established leader, manufacturer, and pioneer in the SMT reflow soldering oven market, Heller Industries receives repeated recognition for
Nordson Electronics Solutions makes reliable electronics an everyday reality. Our ASYMTEK, MARCH, and SELECT brands deliver precision fluid dispensing, conformal coating, plasma treatment and selective soldering equipment.
2747 Loker Ave West
Carlsbad, CA USA
Phone: 18002796835
