Industry Directory: bga 0,5 (1)

Seamark Zhuomao Photoeletric technology(Shenzhen)CO., ltd

Industry Directory | Consultant / Service Provider / Manufacturer

We focus on SMT Inspection and repair since year 2005 and now we are largest BGA rework station manufacturer in China!We provide X-Ray Inspection System,X-ray SMD component counter,BGA Rework System, LED/LCD panel repairing

New SMT Equipment: bga 0,5 (48)

BGA Rework Machine for soldering and desoldering.  Hot Air BGA rework station for printed circuit board repair.

BGA Rework Machine for soldering and desoldering. Hot Air BGA rework station for printed circuit board repair.

New Equipment | Rework & Repair Equipment

BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla

Precision PCB Services, Inc

8 layers PCB with BGA and golden fingers

8 layers PCB with BGA and golden fingers

New Equipment | Fabrication Services

Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.20MM Minimum drilled hole diameter: 8mils Copper thickness: 0.5oz Special process : 0.40MM BGA , golden fingers

CYZON LIMITED

Electronics Forum: bga 0,5 (94)

underfilling of bga

Electronics Forum | Mon May 18 08:59:41 EDT 2009 | ozgurv

Dear All, Does anyone on the forum have experience with underfilling process of bga? We have a component with 0.5mm bga on one of the new products. Customer wants this component to have an underfill. Questions - 1) which kind of epoxy or chemica

BGA 0.5mm pitch Ball 0.3mm assembly and soldering.

Electronics Forum | Wed Dec 26 14:21:47 EST 2007 | gersla

I am looking for suggestion of BGA 0.5mm pitch Ball 0.3mm (BGA 8x8mm)assembly and soldering. Stencil thickness? Stencil reduce? Etc.

Used SMT Equipment: bga 0,5 (45)

Samsung multi-function SM421 chip mounter

Samsung multi-function SM421 chip mounter

Used SMT Equipment | Flexible Mounters

Product Name: Samsung multi-function SM421 chip mounter Product number: SM421 Detailed product introduction Samsung multi function SM421 chip mounter Mounting speed: 21K CPH /QFP (IPC9850) 5.5K CPH Chip (IPC9850) The corresponding components: Ma

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Samsung original multi-function SM421 chip mounter

Samsung original multi-function SM421 chip mounter

Used SMT Equipment | SMT Equipment

Product Name: Samsung multi-function SM421 chip mounter Product number: SM421 Detailed product introduction Samsung multi function SM421 chip mounter Mounting speed: 21K CPH /QFP (IPC9850) 5.5K CPH Chip (IPC9850) The corresponding components: Ma

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: bga 0,5 (40)

Parts & Supplies: bga 0,5 (14)

Agilent Full-automatic BGA Ball Mounti

Agilent Full-automatic BGA Ball Mounti

Parts & Supplies | Repair/Rework

main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr

Goodluck Electronic Equipment Co.,Ltd

Agilent Full-automatic BGA Ball Mounti

Agilent Full-automatic BGA Ball Mounti

Parts & Supplies | Repair/Rework

main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr

Goodluck Electronic Equipment Co.,Ltd

Technical Library: bga 0,5 (4)

Strength of Lead-free BGA Spheres in High Speed Loading

Technical Library | 2008-04-08 17:42:27.0

Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection. This paper reports the results of the measurement of the impact strength of lead-free 0.5±0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension.

Nihon Superior Co., Ltd.

Effect of Process Variations on Solder Joint Reliability for Nickel-based Surface Finishes

Technical Library | 2014-11-06 16:43:24.0

This paper summarizes the results of recent investigations to examine the effect of electroless nickel process variations with respect to Pb-free (Sn-3.0Ag-0.5Cu) solder connections. These investigations included both ENIG and NiPd as surface finishes intended for second level interconnects in BGA applications. Process variations that are suspected to weaken solder joint reliability, including treatment time and pH, were used to achieve differences in nickel layer composition. Immersion gold deposits were also varied, but were directly dependent upon the plated nickel characteristics. In contrast to gold, different electroless palladium thicknesses were independently achieved by treatment time adjustments.

Atotech

Videos: bga 0,5 (55)

printed circuit board conveyor,PCB conveyor,1000mm PCB conveyor

printed circuit board conveyor,PCB conveyor,1000mm PCB conveyor

Videos

https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/100.html PCB linking conveyor and PCB belt conveyor mainly used to connect different type PCB board handing equipment effectively for the SMT production line. ASCEN technology is ava

ASCEN Technology

printed circuit board conveyor,PCB conveyor,1000mm PCB conveyor

printed circuit board conveyor,PCB conveyor,1000mm PCB conveyor

Videos

https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/100.html PCB linking conveyor and PCB belt conveyor mainly used to connect different type PCB board handing equipment effectively for the SMT production line. ASCEN technology is ava

ASCEN Technology

Express Newsletter: bga 0,5 (473)


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