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professional manufacturer of pcb
New Equipment | Rework & Repair Equipment
Optical bga rework station ZM-R6500 for large motherboard pcba and X399 SP3R2 4094 PIN repairing We provide customized BGA machine, you are welcome to contact Rita Li by whatsapp/wechat/viber:0086-134 3448 1030 Product Application S
New Equipment | Rework & Repair Equipment
Full automatic BGA rework station WDS-750 xbox one controller motherboard repair machine price WDS BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop, mobile phone, xbox360,ps3,etc. The main use
Electronics Forum | Wed Oct 09 08:44:05 EDT 2002 | apg
Dear colleagues. I ask you to prompt me about necessity of drawing pastes through a stensil at the soldering micro BGA with step between leeds 1 mm and 0,8 mm or uses only a flux for this purpose. And what most suitable paste for the soldering of su
Electronics Forum | Thu Dec 15 08:20:39 EST 2005 | jhernan9
The BGA pitch is 0.8 mm and stencil thickness is 0.005"
Industry News | 2011-02-14 16:05:28.0
Design engineers using 0.8mm pitch 96 position BGA ICs will be interested in the PA-BGA96C-Z-01 probing and prototyping adapter with GHz BGA socket from Ironwood Electronics. Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing clock driver IC's. The socket is constructed with high performance and low inductance elastomer contactor.
Industry News | 2001-08-10 07:53:10.0
SAMSUNG has shipped the first engineering samples of a MCP device integrating 64Mb NAND-type flash memory and 8Mb SRAM. * Cost#ffective optimal solution for 3G mobile phones. * Mass production set for the second quarter of 2001.
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Parts & Supplies | Assembly Accessories
12MM Calibration Tape .12MM Calibration Tape 20 Inch Folding Bike Ravel Case 20 Inch Folding Bike ravel Case 4*4.1200pcs/bag M0604 8MM Calibration Tape .8MM Calibration Tape 90 degree drive set 90 degree drive set A2E BGA Rework Station Temp Con
Parts & Supplies | Pick and Place/Feeders
QP341 SMT Machine FUJI Nozzle 3.7m ADBPN-8143 In Pick And Place Machine Description: Model: ADBPN-8143 Description: 3.7mm Used in FUJI QP341 Machine supply All FUJI Machine model Spare Parts, Original new inventory quantities,Original used an
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/collections/bga-rework-stations/products/bga-rework-station-model-zm-r7850as
: 400℃(Max) 11. Max PCB size: Max 640mm×520mm;Min10mm ×10mm 12. BGA chip size: 0.8mm×0.8mm—80mm×80mm 13. Size: L840mm×W960mm×H1600mm BGA Share 0 Share on Facebook Tweet Tweet on Twitter Pin it 0 Pin on Pinterest Fancy Add to Fancy
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