New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
In-line X-Ray MX-2000 Inspection System Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc.
Electronics Forum | Wed May 25 15:40:27 EDT 2005 | james
Has anyone had good luck with the reflow on these extremely heavy bga's. This bga has 1517 balls and requires alot of heat because of the thickness of the part. Just wondering if anyone out there can help me.
Electronics Forum | Wed May 25 17:35:53 EDT 2005 | russ
What are the problems that you are seeing?
Used SMT Equipment | Pick and Place/Feeders
Product number: YV100 Ⅱ Products in detail YAMAHA multi-function chip mounter YAMAHA YV100II The brand YAMAHA model YV100 - II Automatic manual automatic SMT speed 10000(grain per hour) Japan's YAMAHA YV100II SMT machine: The patch speed: 0
Used SMT Equipment | Semiconductor & Solar
Model YV100II SMT speed :0.25 SEC /CHIP high speed mount Substrate size: L600*W400(Max)/L50*W50(Min) Substrate thickness 0.4-3.0 Mounting accuracy ± 0.1mm/CHIP ±0.08/QFP Power three-phase AC220/208/230/240/380/400/416 v + / - 10%,
Industry News | 2017-02-05 10:18:08.0
The SMTA is pleased to announce its 2017 Educational Programming that includes conferences, webtorials and webinars, certification program and online training courses.
Industry News | 2015-08-23 09:03:52.0
IPC — Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit technical conference abstracts for IPC APEX EXPO 2016 at the Las Vegas Convention Center in Las Vegas. The technical conference will be held March 15-17, 2016. The deadline for technical conference paper abstracts has been extended to September 14,, 2015.
Parts & Supplies | Assembly Accessories
Product name: YV100X YAMAHA multi-functional chip mounter Product number: YV100X Products in detail YAMAHA multi-function placement machineYAMAHA YV100X substrate size: ATS20 (end to put) W -AT assembly: L460 * W250 (Max)/L50 * W50 (Min)sub
Parts & Supplies | Assembly Accessories
Product name: YV100XG YAMAHAmulti-functional chip mounter Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHAYV100XG High speed and high precisionmulti-function modular placement machine 0.18 seconds/CHIP ul
Technical Library | 2021-12-16 01:45:05.0
In the 1990's, both BGA (Ball Grid Array) and CSP (Chip Size Package) are entering their end in the front-end packaging materials and process technology. Both BGA and CSP like SMD (Surface Mount Device) from the I 980's and THD (Through-Hole mount Device) from the 1970's are reaching its own impasse in terms of maximizing its electrical, mechanical, and thermal performances, size, weight, and reliability.
1. Manufacturing location of yamaha medium-speed placement machine 2. YV100XG factory year period 2000-2006; YV100XGP general year: 2005-2007 (now discontinued; only second-hand equipment is on sale in the market) 3. This model is a medium-
1. Manufacturing location of yamaha medium-speed placement machine 2. YV100XG factory year period 2000-2006; YV100XGP general year: 2005-2007 (now discontinued; only second-hand equipment is on sale in the market) 3. This model is a medium-
Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support
Duties & Responsibilities (Equipment Technician): Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment. Conduct Preventive maintenance
Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=ALTERA&PN=EP4SE530H40C3
: IC, Stratix IV Device Physical Description: Ball Grid Array (BGA), 1.00 mm pitch, square; 1517 pin, 42.50 mm L X 42.50 mm W X 3.50 mm H body Manufacturer
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_yestech_ytx3000_xray.html
) Variable zoom magnification to 120x Full 360 degrees of rotation *BGA / Flip Chip * Solder joint quality * Voids * Bond wires * Electronic and Sealed Assemblies
