Industry Directory: bga backing (5)

Concept 2 Market, Inc.

Industry Directory | Consultant / Service Provider / Manufacturer

Full Service Electro Mechanical and Electronic Contract Assembly Services Provider

Concept 2 Market, Inc.

Industry Directory | Manufacturer

Electronic Assembly Solutions for high mix technology small to medium runs. Top quality with manufacturability engineering ingenuity.

New SMT Equipment: bga backing (172)

Semi automatic solder paste printer S400

Semi automatic solder paste printer S400

New Equipment | Assembly Services

Product features: The servo system is convenient and accurate for positioning. The Japanese THK guide rail and Taiwan STK variable frequency motor are used to drive the scraper base to ensure the printing accuracy. The printing scraper can be rota

KingFei SMT Tech

1.2m LED light bar special semi-automatic solder paste printing machine S1200

1.2m LED light bar special semi-automatic solder paste printing machine S1200

New Equipment |  

technical parameter Model: s1200 (special type for LED light bar) Overall dimension (L × w × h): 1650 × 620 × 1550 (mm) Platform size: 320 × 1300 (mm) PCB size: 250 × 1250 (mm) Applicable template size: 550 ×

KingFei SMT Tech

Electronics Forum: bga backing (339)

Re: bga

Electronics Forum | Mon Sep 06 22:35:59 EDT 1999 | KEVIN SIMPSON

| I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | these machines dont even offer bga selections. These machines do

Re: bga

Electronics Forum | Tue Sep 07 22:15:26 EDT 1999 | NAZEEH CHAUDRY

| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac

Used SMT Equipment: bga backing (3)

Panasonic CM20F-M  1KFZ0088

Panasonic CM20F-M 1KFZ0088

Used SMT Equipment | Pick and Place/Feeders

Machine size: length 1500 * width 2000 * height 1500 (unit: mm)  Machine structure: 3 groups of placement heads, different nozzles can be replaced automatically  Machine specifications: standard version, front loading rack and tube load

Qinyi Electronics Co.,Ltd

I-Pulse M20  /  Y35128

I-Pulse M20 / Y35128

Used SMT Equipment | Pick and Place/Feeders

Board size (without buffer function) minimum L50 x W30mm~maximum L1,480 x W510mm Substrate size (when using inlet and outlet buffer functions) Minimum L50 x W30mm~Maximum L540 x W510mm Substrate thickness 0.4~4.8mm Board conveying direction: left&

Qinyi Electronics Co.,Ltd

Industry News: bga backing (51)

Investment Boosts SMT Placement and Rework

Industry News | 2003-06-04 09:19:23.0

With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

SMTnet

MIRTEC to Exhibit Extensive Range of AOI, SPI, X-ray and Specialized LED Inspection Systems at IPC APEX 2012

Industry News | 2012-01-23 00:02:12.0

MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI, X-ray and LED inspection systems at the IPC APEX Expo in booth #3637.

MIRTEC Corp

Parts & Supplies: bga backing (145)

Juki 710 head motherboard E8621715BA0 E86227150A0

Juki 710 head motherboard E8621715BA0 E86227150A0

Parts & Supplies | Pick and Place/Feeders

JUKI 710 head motherboard E8621715BA0 E86227150A0 Other juki parts: E86217210A0 BGA BOARD ASM E86217290A0 TEMPERATURE SENSOR PWB ASM. E86227150A0 HEAD SUB UNIT BASE ASM. E86227290A0 LIGHT 2 PWB ASM. E86237000A0 HEAD RELAY CIRCUIT BOARD ASM E86

ZK Electronic Technology Co., Limited

Juki E8736725000 Y AXIS FL TUBE WITH VELCRO TAP

Juki E8736725000 Y AXIS FL TUBE WITH VELCRO TAP

Parts & Supplies | Pick and Place/Feeders

JUKI 740 E8736725000 Y AXIS FL TUBE WITH VELCRO TAP Other juki parts: E8702725000 BACK LIGHT FOR LCD(SHARP) E8735725000 X AXIS FL TUBE WITH VELCRO TAP E87357250A0 X AXIS FL TUBE OVER SUMITECH G E8736725000 Y AXIS FL TUBE WITH VELCRO TAP E873672

ZK Electronic Technology Co., Limited

Technical Library: bga backing (3)

Advanced Thermal Interface Materials for Enhanced Flip Chip BGA

Technical Library | 2010-01-06 22:27:03.0

Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient manner. Most semiconductor companies have developed some type of thermally enhanced FCBGA package that provides heat dissipation through the back of the die to a heat spreader.

Henkel Electronic Materials

Transient Solder Separation of BGA Solder Joint During Second Reflow Cycle

Technical Library | 2019-05-15 22:26:02.0

As the demand for higher routing density and transfer speed increases, Via-In-Pad Plated Over (VIPPO) has become more common on high-end telecommunications products. The interactions of VIPPO with other features used on a PCB such as the traditional dog-bone pad design could induce solder joints to separate during the second and thereafter reflows. The failure has been successfully reproduced, and the typical failure signature of a joint separation has been summarized.To better understand the solder separation mechanism, this study focuses on designing a test vehicle to address the following three perspectives: PCB material properties, specifically the Z-direction or out-of-plane Coefficient of Thermal Expansion (CTE); PCB thickness and back drill depth; and quantification of the driving force magnitude beyond which the separation is due to occur.

Cisco Systems, Inc.

Videos: bga backing (9)

NexJet NJ-8 System with ReadiSet Jet Cartridge

NexJet NJ-8 System with ReadiSet Jet Cartridge

Videos

The NexJet® 8 System with ReadiSet™ Jet Cartridge offers increased jet frequency combined with advanced consumable management - it's as easy as ReadiSet and Jet. Read more at http://www.nordsonasymtek.com/nexjet

ASYMTEK Products | Nordson Electronics Solutions

Demonstration of BGA rework via stencil printing. BEST's StikNPeel stencil is an adhesive backed stencil which allows users to stick the stencil in to place and simply peel it off the PCB with a temporary adhesive system.

Demonstration of BGA rework via stencil printing. BEST's StikNPeel stencil is an adhesive backed stencil which allows users to stick the stencil in to place and simply peel it off the PCB with a temporary adhesive system.

Videos

Demonstration of BGA rework via stencil printing. BEST's StikNPeel stencil is an adhesive backed stencil which allows users to stick the stencil in to place and simply peel it off the PCB with a temporary adhesive system. This leaves consistent print

BEST Inc.

Career Center - Resumes: bga backing (3)

Production Supervisor

Career Center | King, North Carolina | Management,Production,Quality Control

Production Supervisor Responsible for all aspects of department operations Directly supervised up to 80 team members Kaizen team leader 5S, Lean Manufacturing, working with Six Sigma tools Built team that continually produced 98% yields and Won

TECHNICIAN

Career Center | THRISSUR, India | Maintenance,Production

HANDLING OF MAINTENANCE Camelot,Mascot, Selective Soldering,Wave Soldering,Aquastorm 200,H-500 HI-Z,Kolb,kerry&PBT,GETECH, ATI 105 & Final Touch 101,Heller,Btu&vapour phase,Shuttle,SRT,ESD ,Electrical maintenance . Knowledge in using SLIM KIC 2000&

Express Newsletter: bga backing (593)

trailer.cfm

Back to Top Questions or comments? Contact us      © 1995-99 SMTnet

trailer.cfm

Back to Top Questions or comments? Contact us      © 1995-99 SMTnet

Partner Websites: bga backing (32)

SMD YS12 YS24 YS24S Yamaha Label feeder

| https://www.feedersupplier.com/sale-13067539-smd-ys12-ys24-ys24s-yamaha-label-feeder.html

: SMD YS12 YS24 YS24S Yamaha Label Feeder Warranty: ONE WEEK Usage: Smt Pick And Place Machine Size: 2 X 2mm Thickness: 0.05mm~1mm Backing Paper Width

Tape & Label Production Equipment | Nordson

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/tape-and-label?con=t&page=35

parts and equipment are designed to improve processes for adhesive tape manufacturers. If you create tape, disposable hygiene products or labels, our applicators can help ensure the backing goes and stays where it’s needed

ASYMTEK Products | Nordson Electronics Solutions


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