Industry Directory: bga ball cracked during smt process (17)

KingFei SMT Tech

KingFei SMT Tech

Industry Directory | Manufacturer's Representative / Manufacturer / Equipment Dealer / Broker / Auctions / Consultant / Service Provider

Main Products: 1. Original new and Original Used SMT/AI Spare Parts. 2. SMT Equipments And Related Machine( Loader/Unloader,SMT Calibration, SMT Feeder Carts,Conveyer etc.) 3. Maintenace and Repair Service

ScanCAD International, Inc.

ScanCAD International, Inc.

Industry Directory | Consultant / Service Provider / Manufacturer / Other

ScanCAD is an industry leader in inspection, measurement, process control and reverse engineering. Our solutions support OEM's, manufacturers, stencil fabricators, repair depots, and others in optimizing quality and yield.

New SMT Equipment: bga ball cracked during smt process (46)

DJ-2200 DispenseJet Non-Contact Flux Jet

DJ-2200 DispenseJet Non-Contact Flux Jet

New Equipment | Dispensing

Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi

ASYMTEK Products | Nordson Electronics Solutions

QWIKTRAY Custom Matrix Trays for Electronic Components

QWIKTRAY Custom Matrix Trays for Electronic Components

New Equipment | Pick & Place

Do you have a unique component that isn’t available in tape and reel? Tired of hand placing those components because you don’t have a compatible feeder? Can’t find JEDEC trays for your components and you need one yesterday? The answer to all of

Count On Tools, Inc.

Electronics Forum: bga ball cracked during smt process (246)

BGA ball crack at pad/solder ball interface

Electronics Forum | Wed Nov 29 00:43:45 EST 2006 | callckq

Dear all, Recently, we run 2 models with heat sink attachment on top of this BGA(on top of this BGA, there is flip chip attached at the center of the BGA). Hence, the center of the BGA is higher than corner/side. We used conventional way to attach

mirco bga stencil opening

Electronics Forum | Thu Sep 12 10:45:29 EDT 2002 | pbarton

We have used a laser cut stencil 0.15mm (0.006") thick with 0.3mm (0.012") square apertures radiused in the corners 0.06mm (0.0025") to aid paste release. This approach with the (type 3) paste we use has proven successful on thousands of devices plac

Used SMT Equipment: bga ball cracked during smt process (14)

Yamaha YV100XGP chip mounter at a moderate speed

Yamaha YV100XGP chip mounter at a moderate speed

Used SMT Equipment | SMT Equipment

Product name: YV100XGP YAMAHA  chip mounter at a moderate speed Product number: YV100XGP Products in detail YAMAHA multi-function chip mounter YAMAHA YV100XGP High speed and high precision multi-function modular placement machine 0.18 seconds/

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Samsung mounter CP45FV-NEO multi-function chip mounter

Samsung mounter CP45FV-NEO multi-function chip mounter

Used SMT Equipment | SMT Equipment

Product Name: Samsung CP45FV-NEO multi-function chip mounter Product number: CP45FV-NEO Detailed product introduction Samsung CP45FV-NEO multi-function chip mounter Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max sp

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: bga ball cracked during smt process (262)

GPD Global's PCD Dispensing on Its MAX Series Platform Recognized with Two 2011 Global Technology Awards

Industry News | 2011-11-20 13:36:13.0

GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform

GPD Global

GPD Global's PCD Dispensing on Its MAX Series Platform Wins Another Industry Award

Industry News | 2012-03-05 14:26:45.0

GPD Global has been awarded a 2012 NPI Award in the category of Dispensing Equipment for its PCD Dispensing on the MAX Series Platform.

GPD Global

Parts & Supplies: bga ball cracked during smt process (1)

ASC International 3D SPI-7500 Vision CE

ASC International 3D SPI-7500 Vision CE

Parts & Supplies | SPI / Solder Paste Inspection

Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK

KingFei SMT Tech

Technical Library: bga ball cracked during smt process (5)

What is the application of moisture proof dry cabinet?

Technical Library | 2019-04-11 05:59:57.0

Are your MSD safely stored? As humidity is found to be one of the key reasons for rejected products, many manufacturers are taking measures to control the humidity to increase their production efficiency and save the cost. In the industries of semi-conductor and electronics, the key section in which the rejected products are most probably to be made is that during the heating process of SMT, the IC(e.g.,PBGA,BGA,or TQFD) is likely to crack and thus cause non-effective welding because of the humidity. Climatest Symor® auto dry cabinet is the best solution to avoid the cracking and non#2;effective welding by dehumidifying the surface of your components. The dry unit can be used for 20 years without replacement,and controller is calibration free within 5 years.We attach dry cabinet application with different humidity range,welcome to download.

Symor Instrument Equipment Co.,Ltd

What is usage of Electronic dry cabinet?

Technical Library | 2019-08-19 23:55:20.0

Electronic dry cabinet for MSD storage Humidity is one of the key reasons for rejected products, many manufacturers are taking measures to control the humidity to increase production efficiency and save cost. In semiconductor and electronic industry, the key section of rejected products mostly happen during SMT heating process, Climatest Symor® auto dry cabinet is a superior solution to avoid the cracking. Warranty: two years with lifetime technical support

Symor Instrument Equipment Co.,Ltd

Videos: bga ball cracked during smt process (26)

Flux spray coating on PCB with DispenseJet DJ-2200

Flux spray coating on PCB with DispenseJet DJ-2200

Videos

Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.

ASYMTEK Products | Nordson Electronics Solutions

PCB depaneling machine|PCB separator|PCB depaneling equipment

PCB depaneling machine|PCB separator|PCB depaneling equipment

Videos

http://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2015/0607/137.html ?????????/V-cut depaneling/PCB Depanelers/??pcb????/PCB cutting machine/pcb depaneling machine/depanelizing pcb

ASCEN Technology

Training Courses: bga ball cracked during smt process (3)

Virtual Course: PCB Design for Implementing 3D and High Density Semiconductor Package Technologies

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

Surface Mount Technology Association (SMTA)

BGA Rework/Profiling Training Course

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

BEST IPC Training

Events Calendar: bga ball cracked during smt process (3)

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Surface Mount Technology Association (SMTA)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Career Center - Jobs: bga ball cracked during smt process (2)

Packaging Engineer

Career Center | Sherman, Texas USA | Engineering,Production,Research and Development,Technical Support

SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critic

Texas Instruments

Senior Engineering Microassembler

Career Center | Brooklyn, New York USA | Engineering,Production

Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications.  With design, sales and manufacturing locations in over 30 countries, Mini-Ci

Mini-Circuits

Career Center - Resumes: bga ball cracked during smt process (18)

SMT process and equipment engineer

Career Center | BANGALORE, India | Engineering,Maintenance,Production

Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance

Staff Process Engineer

Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control

15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience

Express Newsletter: bga ball cracked during smt process (1139)

SMT Express, Volume 3, Issue No. 5 - from SMTnet.com

SMT Express, Volume 3, Issue No. 5 - from SMTnet.com Volume 3, Issue No. 5 Thursday, May 17, 2001 Featured Article Return to Front Page A Closer Look at Area Array Components by Gil Zweig , Glenbrook Technologies, Inc . Combining

Developing an effective, fast-curing, environmentally sound conformal coating

Developing an effective, fast-curing, environmentally sound conformal coating Developing An Effective, Fast-Curing, Environmentally Sound Conformal Coating The electronics industry has recently undertaken the transition to lead-free processing

Partner Websites: bga ball cracked during smt process (234)

Ball Shear Solder Ball Shear | Nordson DAGE

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/ball-shear-solder-ball-shear?con=t&page=4

. Shear testing is in accordance with: JEDEC JESD22-B116 - Au Ball Shear JEDEC JESD22-B117 – Solder Ball Shear ASTM F1269 - Ball Bond Shear The position of shear tool during testing is critical for accurate and repeatable test results

ASYMTEK Products | Nordson Electronics Solutions

The Greening of the Reflow Process

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/grnreflo.pdf

The Greening of the Reflow Process The Greening of the Reflow Process July 2001, EP& P Magazine Atsushi Kikuchi Sony Electronics The Greening of the Reflow Process, Through Partnership by Atsushi Kikuchi After years of concentration on resolving productivity-related concerns such as

Heller Industries Inc.


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KingFei SMT Tech
KingFei SMT Tech

Main Products: 1. Original new and Original Used SMT/AI Spare Parts. 2. SMT Equipments And Related Machine( Loader/Unloader,SMT Calibration, SMT Feeder Carts,Conveyer etc.) 3. Maintenace and Repair Service

Manufacturer's Representative / Manufacturer / Equipment Dealer / Broker / Auctions / Consultant / Service Provider

3 Road Xintang, Fuhai Street,Fuyong
Shenzhen, 30 China

Phone: 13713862102

Electronic Solutions

High Throughput Reflow Oven
Formic Reflow Soldering

World's Best Reflow Oven Customizable for Unique Applications
2024 Eptac IPC Certification Training Schedule

Training online, at your facility, or at one of our worldwide training centers"
Solder Paste Dispensing

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
ZK Electronic 20 Years+ of SMT INDUSTRY EXPERIENCE

"回流焊炉"