SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
SMT Express, Volume 3, Issue No. 5 - from SMTnet.com Volume 3, Issue No. 5 Thursday, May 17, 2001 Featured Article Return to Front Page A Closer Look at Area Array Components by Gil Zweig , Glenbrook Technologies, Inc . Combining
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
]. Thus even with vacuum reflow, the debate remains regarding the effect of voiding on solder joint reliability. This paper reports the results from a test To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
value of 1x108 Ω or greater. Slump Test defined in IPC TM-650 2.4.35 to measure the change in shape of solder paste after deposition and before reflow. Solder Balls Small spheres of solder that have separated from a solder deposit during reflow
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