Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc. ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat
New Equipment | Rework & Repair Equipment
Finally! A High End BGA Rework System at an affordable price. Fits board up to 25" Places components from 4mm to 50mm Standard resolution Split Vision Assist for Component Alignment Plug and Play. Fully self contained with is own internal air
Electronics Forum | Mon Aug 21 16:37:46 EDT 2006 | davef
We too doubt that you have super glue on your BGA. If you want advice on removing super glue, look here: * http://www.supergluecorp.com/removingsuperglue.html * http://www.loctiteproducts.com/questions.asp?answerme=116
Electronics Forum | Sat Sep 02 10:10:18 EDT 2006 | cyber_wolf
HAHAHAHA ! Did you read the section about getting super glue off lips ? How could you accidentally super glue your lips together? Funny stuff man.....
Used SMT Equipment | Flexible Mounters
Product Name: Samsung chip mounter CP45FV04 Product number: CP45FV04 Detailed product introduction Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max speed IPC9580, 14900CPH 0.178sec/chip (1608); IC flying camera 0.75s
Used SMT Equipment | Flexible Mounters
Product Name: Samsung high speed SM411 chip mounter Product number: SM411 Detailed product introduction Samsung high speed SM411 chip mounter parameters type: SM411 On the way: In - flight vision Number: 6 - axis *2 axis platform mount speed:
Industry News | 2003-06-18 08:04:27.0
Recently purchased and installed a new DP-1500-2X Dual-Sided Photoimageable Ink Coater from Circuit Automation
Industry News | 2014-06-22 19:12:37.0
MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.
Parts & Supplies | Pick and Place/Feeders
JUKI 2030 laser board Other juki parts: 40045121 STK EMPTY LAMP 2 ASM 40045126 HEAD L UP/DOWN SENSOR ASM 40045127 HEAD R UP/DOWN SENSOR ASM 40045132 HEAD L EJECTOR ASM 40045133 HEAD R EJECTOR ASM 40045135 FAN MOTOR(X MOTOR) ASM 40045136 LASER
Parts & Supplies | Pick and Place/Feeders
JUKI 2020 board E86177290A0 OPERATION SW BOARD ASM Other parts: E86147250A0 FEEDER UNIT PWB ASM. E86147290A0 XMP RELAY BOARD ASM. E8614729AA0 XMP RELAY BOARD A ASM. E8614729MA0 XMP RELAY BOARD ASM. (M) E8614729NA0 XMP RELAY BOARD ASM E86157150
Technical Library | 2019-06-12 10:33:58.0
The success of ball grid array (BGA) placement on electronic assemblies is as much a matter of proper preparation and planning, as it is technique. In some designs, it is more appropriate to apply BGAs using a rework station that isolates the placement of the device, without subjecting the entire assembly to thermal reflow. This is especially beneficial in board constructions where the number of BGAs is limited, and the application of the solder paste is difficult, due to small pitch features that stretch the limitation of the stencil construction. Another application for rework stations, involves very large and thermally conductive BGAs, which will not uniformly reflow with other components on the assembly, and may require special process parameters for their proper placement. The most common use of BGA rework stations are for assemblies requiring BGA removal and replacements due to failures in the initial assembly stage.
Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
Demo on how to reball a BGA component using a universal reball fixture.
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA
SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework
Events Calendar | Mon May 04 00:00:00 EDT 2020 - Mon May 04 00:00:00 EDT 2020 | ,
Ball Grid Array Rework - How to Do It Successfully
Career Center | Space Coast, Florida USA | Engineering,Research and Development
Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit
Career Center | Melbourne, Florida USA | Engineering
Advanced Manufacturing Technology Position Description Job Description: AMT Engineer � Level 4 Support IR&D and Program activities Division wide working on the development, qualification, and implementation of electronic packaging technologies, wi
Career Center | , California | Quality Control
Tammy T Vo P.O. Box 2213 (714) 254-5073 E-mail: nhutamvo@yahoo.com Position of Interest Senior Quality Inspector Aerospace Manufacturing. / Electronic PCBA/Advanced coating technologies Profile of Qualifications 12 years of experience wo
SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) SOLDER PASTE APPLICATION (WHEN AND AS SPECIFIED) Select
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/
. Welcome to our store. We are the BGA Experts with over 30 years of BGA Rework & Assembly experience. We provide a complete line of BGA Rework Stations, and other products for circuit board rework repair and assembly
| https://www.eptac.com/soldertips/soldertip-46-open-connections-found-on-bga-components/
. We have experimented with many minor adjustments, yet this occasional problem continues. Do you have any suggestions? Answer : Based upon the warp and twist characteristics of the printed board laminate materials and the BGA, this could be a major starting point for investigating this condition
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