Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Electronics Forum | Thu May 10 10:33:46 EDT 2001 | Eyal Duzy
Genny, I would like to correct part of the things that you were told. As far as I know, X-Ray tools are not positioned as tools to find solder volume simply because it is not a strong point for them. An X-Ray image is either a projection (2D transm
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
(e.g. tensile strength, melting temperatures). Area Array Package A surface-mount component with a grid of connection points on the bottom. B Ball Grid Array (BGA
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-prototyping-what-you-should-be-looking-for/
. You can also check the BGA/QFN (ball grid array/quad flat no-leads) parts box and the AS9100 compliance box. Advertised Specials Watch out for our advertised specials, since these might cover most of your basic specifications and you could get an even better deal from us than you usually do
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