Industry Directory | Consultant / Service Provider / Manufacturer
Electronic manufacturing services - electronic design, development and manufacturing. Circuit board design, prototyping, FPGA services, signal integrity and simulation, pcb assembly. Factories in California USA and Malaysia.
Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Affordable Manufacturing Execution System (MES), Shop Floor Automation and Integration Software CELLS WORKFLOW Product Tracking MES is an affordable full Manufacturing Process Control Software System providing Plant Intelligence for any industry.
Electronics Forum | Tue Apr 27 09:31:45 EDT 1999 | Robert L. McCallum
On circuit board assemblies first pass yields need to be above 98%, if a supplier is below this level it is a indication that: he has poor control of the manufacturing process; Poor component selection (price over quality; excepted a poor design from
Electronics Forum | Fri Sep 17 13:26:43 EDT 1999 | The Guc
| | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | these machines dont even offer bga selections. These machine
Used SMT Equipment | AOI / Automated Optical Inspection
Capture on the fly technology 3D Fusion Lighting (RGB+White LED's) 5 megapixel color imaging 2 top-down and 4 side angle cameras Quick set-up High speed, high defect coverage Low false failure rate Programmable conveyor for boards up to 20 x 2
Used SMT Equipment | Flexible Mounters
Product Name: Samsung chip mounter CP45FV04 Product number: CP45FV04 Detailed product introduction Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max speed IPC9580, 14900CPH 0.178sec/chip (1608); IC flying camera 0.75s
Industry News | 2020-11-03 18:16:39.0
2020 Global Surface Mount Technology Company Of The Year Award (Soldering Equipment)
Parts & Supplies | Pick and Place/Feeders
JUKI 2030 laser board Other juki parts: 40045121 STK EMPTY LAMP 2 ASM 40045126 HEAD L UP/DOWN SENSOR ASM 40045127 HEAD R UP/DOWN SENSOR ASM 40045132 HEAD L EJECTOR ASM 40045133 HEAD R EJECTOR ASM 40045135 FAN MOTOR(X MOTOR) ASM 40045136 LASER
Parts & Supplies | Pick and Place/Feeders
JUKI 2020 board E86177290A0 OPERATION SW BOARD ASM Other parts: E86147250A0 FEEDER UNIT PWB ASM. E86147290A0 XMP RELAY BOARD ASM. E8614729AA0 XMP RELAY BOARD A ASM. E8614729MA0 XMP RELAY BOARD ASM. (M) E8614729NA0 XMP RELAY BOARD ASM E86157150
Technical Library | 2019-06-12 10:33:58.0
The success of ball grid array (BGA) placement on electronic assemblies is as much a matter of proper preparation and planning, as it is technique. In some designs, it is more appropriate to apply BGAs using a rework station that isolates the placement of the device, without subjecting the entire assembly to thermal reflow. This is especially beneficial in board constructions where the number of BGAs is limited, and the application of the solder paste is difficult, due to small pitch features that stretch the limitation of the stencil construction. Another application for rework stations, involves very large and thermally conductive BGAs, which will not uniformly reflow with other components on the assembly, and may require special process parameters for their proper placement. The most common use of BGA rework stations are for assemblies requiring BGA removal and replacements due to failures in the initial assembly stage.
Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
www.unisoft-cim.com/cells.html - CELLS WORKFLOW is affordable, simple to setup & use yet powerful product & job tracking software for fast New Product Introduction (NPI). The CELLS WORKFLOW software provides total traceability in manufacturing floor
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA
SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework
Career Center | Space Coast, Florida USA | Engineering,Research and Development
Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit
Career Center | Melbourne, Florida USA | Engineering
Advanced Manufacturing Technology Position Description Job Description: AMT Engineer � Level 4 Support IR&D and Program activities Division wide working on the development, qualification, and implementation of electronic packaging technologies, wi
Career Center | , | Engineering,Production,Quality Control
SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS
Career Center | Cochin, Kerala India | Engineering,Management,Production,Technical Support
9 Years Experience in SMT Manufacturing Process, Quality Control Process, Testing and Engineering of Windmill power projects. The experience include: - � Skill in selection and installation of new manufacturing lines. � Conduct and analyze process t
SMT Express, Volume 3, Issue No. 5 - from SMTnet.com Volume 3, Issue No. 5 Thursday, May 17, 2001 Featured Article Return to Front Page Solder Paste Measurement: A Yield Improvement Strategy That Helps Improve Profits by Mike Riddle , ASC
to Front Page Solder Paste Measurement: A Yield Improvem
Heller Industries Inc. | https://hellerindustries.com/video/btc-void-reduction-for-yield-and-performance-enhancement-at-smtai-2016/
BTC Void Reduction For Yield and Performance Enhancement at SMTAI 2016 - Heller Industries Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-footprint_topic2430_post10003.html
. I would expect the BGA Default Values in Library Expert to yield the same answer as IPC. Thanks, Greg Tom H Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined
