Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Industry Directory | Manufacturer
pcb construction@testing using surface mount and through hole components.
New Equipment | Rework & Repair Services
On the cutting edge of technology, we offer a full line of high tech services to assist contract manufacturer's and product research and developers. Specializing in quick turn around times to help get your product to market on time. Training Serv
New Equipment | Education/Training
Solder Training and Solder Certification Courses Taught in Accordance With IPC Soldering Guidelines. We offer a variety of customized courses set up specifically for our customers requirements. An example would be our combination type certificate t
Electronics Forum | Thu Sep 05 03:23:14 EDT 2002 | manic
Hi, I encountered a problem with pbga. One edge either warp downwards or upwards creating bridging or open. This pbga have fr4 at the bottom (compound molding at the top). The fr4 is bigger than the top compound by 3mm at each edge. Pls help. Than
Electronics Forum | Wed Sep 02 06:50:55 EDT 1998 | Masdi Muhammad
Hi, We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent it. Than
Used SMT Equipment | SMT Equipment
Product Name :Panasoinc NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc
Used SMT Equipment | SMT Equipment
Product Name :Panasoinc NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc
Industry News | 2019-01-12 07:42:28.0
IPC – Association Connecting Electronics Industries® announces the winners of the IPC APEX EXPO 2019 Innovation Awards, a celebration of the innovators and forward thinkers who are changing the technological landscape of the electronics industry.
Parts & Supplies | Pick and Place/Feeders
> FUJINTAI TECHNOLOGY CO.,LTD JUKI E9572729CA0 LA (L) CABLE ASM. www.fujintai.com JUKI E95737290A0 MTC I/F(L) CABLE ASM. FUJINTAI TECHNOLOGY CO.,LTD JUKI E95738550A0 DISPESE SV ASM www.fujintai.com JUKI E95747210A0 BAD MARK SENSOR CABLE ASM. FUJI
Parts & Supplies | Pick and Place/Feeders
> FUJINTAI TECHNOLOGY CO.,LTD JUKI E9572729CA0 LA (L) CABLE ASM. www.fujintai.com JUKI E95737290A0 MTC I/F(L) CABLE ASM. FUJINTAI TECHNOLOGY CO.,LTD JUKI E95738550A0 DISPESE SV ASM www.fujintai.com JUKI E95747210A0 BAD MARK SENSOR CABLE ASM. FUJI
Technical Library | 2013-03-12 13:25:18.0
High density and miniaturized circuit assemblies challenge the solder paste printing process. The use of small components such as 0201, 01005 and μBGA devices require good paste release to prevent solder paste bridging and misalignment. When placing these miniaturized components, taller paste deposits are often required. To improve solder paste deposition, a nano-coating is applied to laser cut stencils to improve transfer efficiency. One concern is the compatibility of the nano-coating with cleaning agents used in understencil wipe and stencil cleaning. The purpose of this research is to test the chemical compatibility of common cleaning agents used in understencil wipe and stencil cleaning processes.Compatibility of Cleaning Agents With Nano-Coated Stencils
SMTA International Electronics Exhibition Tuesday, September 29: 9am-5pm Wednesday, September 30: 9am-4pm Donald Stephens Convention Center Rosemont, IL See More Equipment & Technology Than Ever Before! Many of the 160 exhibiting companies will bri
#Xray#Inspection#SEC Nano-focus Tube of 200 nano resolution which is specialized for sub-micron defects of Semiconductor Packaging, Wafer Level Packaging(WLP). -Non-destructive Analysis System -High-Resolution Image with Dual Type CTs -Application
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA
SMTA International 2020 Conference & Exhibition
Career Center | INDIA, India | Engineering,Quality Control
BACHELOR OF ENGINEERING IN ELECTRICAL AND ELECTRONICS ENGINEERING EXPERIENCE IN SURFACE MOUNT MANUFACTURING TECHNOLOGY.
Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support
Duties & Responsibilities (Equipment Technician): Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment. Conduct Preventive maintenance
SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) PRE OPERATIONAL REQUIREMENTS The following requirements shall
Heller Industries Inc. | https://hellerindustries.com/bit_publications/the-last-will-and-testament-of-the-bga-void/
The Last Will And Testament of the BGA Void. - Heller Industries Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
. X-ray inspection is an important tool for ensuring high quality BGA adhesion and allows measurement of BGA solder ball diameter and voiding, solder bridging, missing, open and head-in-pillow intermittent connections
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