Industry Directory | Standards Setting / Certification / Training Provider / Consultant / Service Provider / Manufacturer
BEST is a certified master IPC Training and Solder Certification center. We provide comprehensive courses for both Instructors and Operators including IPC-A-610, IPC J-STD-001, IPC-A-600, IPC/WHMA-A-620, and IPC 7711/7721 standard
Industry Directory | Media / Publisher / Online Resource
Publisher of the book "Mastering and Implementing BGA Technologies"
New Equipment | Education/Training
BEST is an IPC Master Certification Solder Training Center offering Instructor and Operator courses for IPC-A-610, J-STD-001,IPC-A-600, IPC/WHMA 620, IPC 7711/7721 as well as customized classes to meet your specific standard or criteria. Our IPC Trai
New Equipment | Rework & Repair Equipment
http://www.flason-smt.com/product/China-BGA-Rework-Station-factory.html China BGA Rework Station factory Demensions:L650×W630×H850mm PCB size:Max 400×390mm Applicable chips:Max 80×80mm Min 1×1 mm Weight:Approx.60K
Used SMT Equipment | SMT Equipment
Product name: YV100XGP YAMAHA chip mounter at a moderate speed Product number: YV100XGP Products in detail YAMAHA multi-function chip mounter YAMAHA YV100XGP High speed and high precision multi-function modular placement machine 0.18 seconds/
Used SMT Equipment | SMT Equipment
Product name: YV100 yamaha economical chip mounter Product number: YV100 Products in detail YAMAHA multi-function chip mounter YAMAHA YV100A Substrate size: ATS20 (end to put) W - AT assembly: L460 * W250 (Max)/L50 * W50 (Min) Substrate thick
Industry News | 2012-03-05 14:26:45.0
GPD Global has been awarded a 2012 NPI Award in the category of Dispensing Equipment for its PCD Dispensing on the MAX Series Platform.
Industry News | 2019-05-12 15:58:00.0
Fast Shipment of Custom SRT Nozzles
_1.jpg)
BEST, Inc. is an authorized IPC Training Center and offers the IPC-A-610C Certified Instructor Program. Students who complete the program are considered Class "A" Instructors and are qualified to teach the 2 day Worker Proficiency training and certif
Safe, precision rework for SMD, BGA, and other high value chips The versatile SV560A rework station combines precision, reliability, and affordability in an all-in-one solution for all your rework needs, from complex, densely populated PCBAs to simpl
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Sat Sep 26 18:30:00 UTC 2020 - Wed Sep 30 18:30:00 UTC 2020 | Rosemont, Illinois USA
SMTA International 2020 Conference & Exhibition
Career Center | Space Coast, Florida USA | Engineering,Research and Development
Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit
Career Center | , New Jersey USA | Engineering
Process Engineers SMT- Knowledge of all SMT lines. Flip Chip, BGA, experience. Skilled in Solder Paste, Pick and Place, Reflow and BGA rework equipment. Develop and analyze complex designs and develop specs and procedures
Career Center | Corinth, Mississippi USA | Engineering
Responsible for development and control of all processes related to the production of SMT and mixed technology printed circuit board assemblies, in both high volume and low volume, high mix environments. Perform DFM evaluation of customer designs an
Career Center | Fresno, California USA | Engineering
Project Management, New Product Introduction, SMT, BGA, DFM, Facilities layout, Full assembly process support. Project Management: "Green field" site development, Robotic assembly systems, Component development, Assembly Services, Independent desig
(Flex) BGA Using a Polyimide Tape Substrate Trent
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
Lewis & Clark | https://www.lewis-clark.com/product-category/pick-place/
Out Of Stock 2011 Mydata My100 DXE-14 Pick and Place Make: Mydata Model: My100-DXE 14 Vintage: 2011 Software: 2.9.x Details: Electrical Two-Pole Test Electrical Transistor Test Optical Centering Conveyor Shared Databases HYDRA Z High Speed HYDRA High Speed Autoteach Linescan for Z Line Mode Fast Past Sequence Condition: Complete
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Scott Abstract 12-3 CSP SELF-CENTERING ASSESSMENT USING OFFSET NORMALIZATION METHODOLOGY Dr. Paul P.E. Wang and Dr. Katsuji Takasu Abstract 12-2 SOLDER JOINT RELIABILITY OF ChipArray BGA Ahmer Syed and Tony Panczak et al. Abstract 12-2 Ultra CSP: A WAFER
