GTI-5000 BGA "Surface Mount" PCB Analysis The GTI-5000 Computer Image Processor is designed for the x-ray analysis of surface mount, BGA and PCB components. The software can provide analysis of BGA defects including bridging, voids and missing ball
New Equipment | Education/Training
Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for
Electronics Forum | Thu Mar 02 09:23:05 EST 2006 | Bob R.
I never understood the statement "process indicator". The 7095 committee used that wording but didn't explain it. Other than really unusual cases such as champagne voiding, BGA voids are not a reliability issue. A half dozen studies have come to t
Electronics Forum | Thu Apr 23 07:51:45 EDT 2009 | scottp
Every paper I've seen published shows that BGA voids either have no effect or actually give a slight improvement. The one exception are voids with a root cause in bad incoming boards, such as champagne voiding where nearly the entire interface is go
Industry News | 2010-02-17 18:45:59.0
The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference. Short course descriptions are also being solicited.
Industry News | 2010-05-07 16:01:14.0
New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
SMTnet Express, July 19, 2018, Subscribers: 31,194, Companies: 10,991, Users: 24,953 Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design Greg Smith; FCT ASSEMBLY, INC. Reduction of first pass defects in the SMT assembly process
