Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Industry Directory | Training Provider / Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
YAMAHA YV88 Full Automatic High Speed Chip Mounter Board size MAX.460 x 335 MIN.50 x 50 mm PCB Thickness 0.4 ~ 3.0mm Conveyor Transfer Right→ Left(Left→ Right:Option)
YAMAHA YG100R HIGH SPEED PICK AND PLACE MACHINE Model YG100RA(FNC TYPE )/YG100RB(SF TYPE) Object substrate L50×W50mm ～L510×W460mm Mounting efficiency 24000CPH/CHIP (
Used SMT Equipment | Chipshooters / Chip Mounters
1999 Fuji IP-III SMT Pick & Place Note: This lot contains two items. (1) Fuji IP-III SMT Pick & Place Approx Dimensions: 126" x 78" x 78" (1) Fuji MTU-4R Tray Tower Approx Dimensions: 43" x 87" x 70" Location: Jasper, IN USA Serial: 1514 Features: o
Used SMT Equipment | Chipshooters / Chip Mounters
Product name: YV100XG YAMAHA multi-functional chip mounter Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHA YV100XG High speed and high precision multi-function modular placement machine 0.18 seconds/CHIP ul
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Industry News | 2012-03-05 14:26:45.0
GPD Global has been awarded a 2012 NPI Award in the category of Dispensing Equipment for its PCD Dispensing on the MAX Series Platform.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2024-08-20 00:40:08.0
In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.
This video describes the J-STD-001 solder certification program. It is an overview of the program, the certification requirements and the types of credentials. For More Information On IPC J-STD-001 Training Visit Our Website: IPC J-STD-001 CIT Cert
BGA integrated circuits and chip scale packages, CSPs where the solder connections are not visible. This has arisen as a result of the need for greater numbers of interconnections to integrated circuit packages and as a general result of increasing c
Training Courses | | | IPC-7711/IPC-7721 Expert (CSE)
The IPC-7711/IPC-7721 CSE program confirms that an individual has demonstrated the level of knowledge and understanding required to act as a subject matter expert for the IPC-7711/IPC-7721 standard.
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Career Center | , | Engineering
A well respected, cutting edge technology leader in underfill chip scale packaging electronic materials for uses in cell phone, wireless applications and more is in need of a particular combination of experience in process engineering, CSP equipment
Career Center | , New Jersey USA | Engineering
Process Engineers SMT- Knowledge of all SMT lines. Flip Chip, BGA, experience. Skilled in Solder Paste, Pick and Place, Reflow and BGA rework equipment. Develop and analyze complex designs and develop specs and procedures
Career Center | Silang, Cavite, Philippines | Technical Support
WORK EXPERIENCE :Integrated Microelectronics Inc., (Standard Semi-Custom Group) January 2002-present Position: Equipment Lead technician (Surface Mount Technology Area) :Electronic Assemblies, Inc. January 2001-Dec. 2001 Position: E
Career Center | Boise, Idaho USA | Engineering,Research and Development
Sr. Microelectronics Development Engineer Over 20 years experience in SMT Process Development for large Contract Manufacturer. Specialist in Stencil Printing, Component Placement, Dispense, Reflow, Rework, RoHS Processes, Material and Equipment Quali
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/collections/bga-rework-stations/products/smd-bga-rework-station-chip-off-620
SMD & BGA Rework Station, Chip Off-620 – Precision PCB Services, Inc. Search Log in or Create account Cart : 0 Menu Cart 0 Home Catalog Blog About us Log in Create account Search Precision PCB Services, Inc
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/micro-materials-tester?con=t&page=13
. A complete system approach must be taken. Products Content Your results for: Micro Materials Tester Comparing Digital and Analogue X-ray Inspection for BGA, Flip Chip and CSP Nordson DAGE Computerized Tomography Meets the Challenges of IC Package Inspection Nordson DAGE 3D
